Document
Photocouplers Photorelay
TLP3406SRH
TLP3406SRH
1. Applications
• Probe Cards • ATE (Automatic Test Equipment) • Measuring Instruments • High-Speed Logic IC Testers • High-Speed Memory Testers
2. General
The TOSHIBA TLP3406SRH photorelay consists of a photo MOSFET optically coupled to an infrared LED. It is housed in a S-VSON4T package. The TLP3406SRH features a very small on-resistance and on/off switching off current as high as 1.5 A, making it ideal for switching applications in high-speed testers.
3. Features
(1) S-VSON4T: 2.0 (L) mm × 1.45 (W) mm × 1.3 (H) mm (2) Normally opened (1-Form-A) (3) OFF-state output terminal voltage: 30 V (min) (4) Operating voltage: 3 V (max) (5) ON-state current: 1.5 A (max) (6) ON-state resistance: 0.1 Ω (typ.), 0.2 Ω (max) (7) Isolation voltage: 500 Vrms (min) (8) Halogen-free
For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet.
4. Packaging and Pin Assignment
11-2E2
1: Anode 2: Cathode 3: Drain 4: Drain
©2018-2020
1
Toshiba Electronic Devices & Storage Corporation
Start of commercial production
2019-02
2020-10-29 Rev.4.0
5. Internal Circuit
TLP3406SRH
6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 �)
Characteristics
Symbol Note
Rating
Unit
LED Applied input forward voltage
VIN
6
V
Input reverse voltage
Input power dissipation
Input power dissipation derating
(Ta ≥ 25 �)
VR PD ∆PD/∆Ta
6
50
mW
-0.5
mW/�
Junction temperature
Tj
125
�
Detector OFF-state output terminal voltage
VOFF
30
V
ON-state current ON-state current derating
(Ta ≥ 25 �)
ION ∆ION/∆Ta
1.5
A
-15
mA/�
ON-state current (pulsed)
(t = 100 ms, Duty = 1/10)
IONP
4.5
A
Output power dissipation
Output power dissipation derating
(Ta ≥ 25 �)
PO ∆PO/∆Ta
240
mW
-2.4
mW/�
Junction temperature Common Storage temperature
Tj
125
�
Tstg
-40 to 125
�
Operating temperature
Topr
-40 to 110
Lead soldering temperature
(10 s)
Tsol
260
Isolation voltage
AC, 60 s, R.H. ≤ 60 %
BVS
(Note 1)
500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are shorted together.
Note: This device is sensitive to electrostatic discharge (ESD). Extreme ESD conditions should be guarded against by using proper antistatic precautions for the worktable, operator, solder iron, soldering equipment and so on..