Linear Regulator. TPS79533DCQR Datasheet

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TPS79533DCQR Datasheet
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Part TPS79533DCQR
Description Low-Dropout Linear Regulator
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TPS795
SLVS350J – OCTOBER 2002 – REVISED MAY 2019
TPS795 Ultralow-Noise, High-PSRR, Fast, RF, 500-mA, Low-Dropout Linear Regulators
1 Features
1 500-mA low-dropout regulator with enable
• Available in fixed and adjustable (1.2-V to 5.5-V)
versions
• High PSRR (50 dB at 10 kHz)
• Ultralow noise (33 µVRMS, TPS79530)
• Fast start-up time (50 µs)
• Stable with a 1-µF ceramic capacitor
• Excellent load and line transient response
• Low dropout voltage (110 mV at full load,
TPS79530)
• 6-pin SOT-223 and 3-mm × 3-mm VSON
packages
2 Applications
• RF: VCOs, receivers, ADCs
• Audio
• Bluetooth®, wireless LAN
• Cellular and cordless telephones
• Handheld organizers, PDAs
3 Description
The TPS795 family of low-dropout (LDO), low-power
linear voltage regulators features high power-supply
rejection ratio (PSRR), ultralow noise, fast start-up,
and excellent line and load transient responses in
small outline, 6-pin SOT-223 and 3-mm × 3-mm
VSON packages. Each device in the family is stable
with a small 1-µF ceramic capacitor on the output.
The family uses an advanced, proprietary BiCMOS
fabrication process to yield extremely low dropout
voltages (for example, 110 mV at 500 mA). Each
device achieves fast start-up times (approximately
50 µs with a 0.001-µF bypass capacitor) while
consuming very low quiescent current (265 µA,
typical). Moreover, when the device is placed in
standby mode, the supply current is reduced to less
than 1 µA. The TPS79530 device exhibits
approximately 33 µVRMS of output voltage noise at 3-
V output with a 0.1-µF bypass capacitor. Applications
with analog components that are noise-sensitive,
such as portable RF electronics, benefit from the
high-PSRR and low-noise features, as well as from
the fast response time.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS795
SOT-223 (6)
VSON (8)
6.50 mm × 3.50 mm
3.00 mm × 3.00 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.
TPS79530 Ripple Rejection vs Frequency
80
VIN = 4 V
70 COUT = 10mF
CNR = 0.01mF
60
IOUT = 1 mA
50
40
IOUT = 500 mA
30
20
10
0
1 10 100 1 k 10 k 100 k 1 M 10 M
Frequency (Hz)
TPS79530 vs Frequency
0.5
VIN = 5.5 V
COUT = 2.2mF
0.4
CNR = 0.1mF
0.3
IOUT = 1 mA
0.2
IOUT = 0.5 A
0.1
0
100
1k
10 k
Frequency (Hz)
100 k
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



etcTI TPS79533DCQR
TPS795
SLVS350J – OCTOBER 2002 – REVISED MAY 2019
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 6
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagrams ..................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 12
8 Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Application .................................................. 13
8.3 What to Do and What Not to Do ............................. 15
9 Power Supply Recommendations...................... 16
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Examples................................................... 19
11 Device and Documentation Support ................. 21
11.1 Device Support...................................................... 21
11.2 Documentation Support ........................................ 21
11.3 Receiving Notification of Documentation Updates 21
11.4 Community Resources.......................................... 21
11.5 Trademarks ........................................................... 22
11.6 Electrostatic Discharge Caution ............................ 22
11.7 Glossary ................................................................ 22
12 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (May 2015) to Revision J
Page
• Changed DRB package name throughout data sheet from SON to VSON ........................................................................... 1
• Changed Pin Configuration package names; switched designators to match correct package names (typo) ..................... 3
• Added note (1) to Recommended Operating Conditions; moved from Electrical Characteristics.......................................... 4
• Changed thermal values in Thermal Information table........................................................................................................... 4
• Deleted Input Voltage from Electrical Characteristics; already shown in Recommended Operating Conditions................... 5
• Deleted Junction Temperature from Electrical Characteristics; already shown in Recommended Operating Conditions..... 5
Changes from Revision H (August 2010) to Revision I
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Changed front-page graphic .................................................................................................................................................. 1
• Changed Pin Configuration and Functions section; updated table format and added pinout drawings................................. 3
• Changed "free-air" to "junction" temperature in condition statement for Absolute Maximum Ratings .................................. 3
• Added Added Operating junction temperature specification to Electrical Characteristics ..................................................... 5
• Deleted Start-up time symbol ................................................................................................................................................. 5
• Corrected min value for IEN(HI) parameter ............................................................................................................................... 5
• Added Thermal shutdown temperature specification to Electrical Characteristics ................................................................ 5
• Added condition statement to Typical Characteristics section .............................................................................................. 6
• Changed title for Thermal Protection section ...................................................................................................................... 16
Changes from Revision G (July, 2006) to Revision H
Page
• Replaced the Dissipation Ratings table with the Thermal Information table .......................................................................... 4
• Updated the Thermal Protection section .............................................................................................................................. 16
2
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5 Pin Configuration and Functions
DRB Package
8-Pin VSON
Top View
IN 1
IN 2
OUT 3
OUT 4
8 EN
7 N/C
6 GND
5 NR/FB
TPS795
SLVS350J – OCTOBER 2002 – REVISED MAY 2019
DCQ Package
6-Pin SOT-223
Top View
6
12345
NAME
IN
GND
EN
NR
FB
OUT
N/C
PIN
VSON
1, 2
6
8
SOT-223
2
3, 6
1
5
5
5
5
3, 4
4
7
EN
GND NR/FB
IN
OUT
Pin Functions
I/O
DESCRIPTION
I
Unregulated input to the device
Regulator ground
I
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the
regulator into shutdown mode. EN can be connected to IN if not used.
Noise-reduction pin for fixed versions only. Connecting an external capacitor to this pin
bypasses noise generated by the internal bandgap, which improves power-supply
rejection and reduces output noise. (Not available on adjustable versions.)
I
Feedback input voltage for the adjustable device.
(Not available on fixed voltage versions.)
O
Regulator output
No internal connection
6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)(1)
Voltage
Current
Power dissipation
Temperature
IN
EN
OUT
Peak output
Continuous total
Junction, TJ
Storage, Tstg
MIN
MAX
–0.3
6
–0.3
VIN + 0.3
6
Internally limited
See Thermal Information
–40
150
–65
150
UNIT
V
A
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
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Product Folder Links: TPS795
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