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switching diode. BAS16LD Datasheet |
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BAS16LD
Single high-speed switching diode
Rev. 1 — 12 October 2010
Product data sheet
1. Product profile
1.1 General description
Single high-speed switching diode, encapsulated in a SOD882D leadless ultra small
Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
1.2 Features and benefits
High switching speed: trr ≤ 4 ns
Low leakage current
Repetitive peak reverse voltage:
VRRM ≤ 100 V
AEC-Q101 qualified
Low capacitance
Reverse voltage: VR ≤ 100 V
Ultra small and leadless SMD plastic
package
Solderable side pads
1.3 Applications
High-speed switching
General-purpose switching
1.4 Quick reference data
Table 1. Quick reference data
Symbol
IF
IR
VR
trr
Parameter
forward current
reverse current
reverse voltage
reverse recovery time
Conditions
VR = 80 V
Min Typ Max
[1] -
-
215
-
-
0.5
-
-
100
[2] -
-
4
[1] Device mounted on an FR4 Printed-Circuit Board (PCB) with 60 μm copper strip line.
[2] When switched from IF = 10 mA to IR =10 mA; RL = 100 Ω; measured at IR = 1 mA.
Unit
mA
μA
V
ns
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Nexperia
BAS16LD
Single high-speed switching diode
2. Pinning information
Table 2.
Pin
1
2
Pinning
Description
cathode
anode
[1] The marking bar indicates the cathode.
3. Ordering information
Simplified outline
[1]
1
2
Transparent
top view
Graphic symbol
1
2
006aab040
Table 3. Ordering information
Type number Package
Name
Description
BAS16LD
-
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.4 mm
Version
SOD882D
4. Marking
Table 4. Marking codes
Type number
BAS16LD
Marking code[1]
1000
0000
[1] For SOD882D binary marking code description, see Figure 1.
4.1 Binary marking code description
CATHODE BAR
READING DIRECTION
VENDOR CODE
READING EXAMPLE:
0111
1011
READING DIRECTION
Fig 1. SOD882D binary marking code description
MARKING CODE
(EXAMPLE)
006aac477
BAS16LD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© Nexperia B.V. 2010. All rights reserved.
2 of 11
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Nexperia
BAS16LD
Single high-speed switching diode
5. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VRRM
VR
IF
IFRM
IFSM
Ptot
Tj
Tamb
Tstg
repetitive peak reverse
voltage
reverse voltage
forward current
repetitive peak forward
current
non-repetitive peak forward
current
total power dissipation
junction temperature
ambient temperature
storage temperature
tp ≤ 0.5 μs;
δ ≤ 0.25
square wave
tp = 1 μs
tp = 1 ms
tp = 1 s
Tamb ≤ 25 °C
-
-
[1]
-
[2]
-
-
-
[1][3] -
-
−55
−65
[1] Device mounted on an FR4 PCB with 60 μm copper strip line.
[2] Tj = 25 °C prior to surge.
[3] Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Max Unit
100
V
100
V
215
mA
500
mA
4
A
1
A
0.5
A
250
mW
150
°C
+150 °C
+150 °C
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
[1] Device mounted on an FR4 PCB with 60 μm copper strip line.
[2] Reflow soldering is the only recommended soldering method.
Min Typ Max Unit
[1][2] -
-
500 K/W
BAS16LD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 12 October 2010
© Nexperia B.V. 2010. All rights reserved.
3 of 11
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