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MPXV7002GC6T1

NXP

Integrated Silicon Pressure Sensor

MPXV7002 Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Rev. ...


NXP

MPXV7002GC6T1

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Description
MPXV7002 Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Rev. 5 — 5 May 2021 Product data sheet 1 General description The MPXV7002 series piezoresistive transducers are monolithic silicon pressure sensors. The MPXV7002 is designed for a wide range of applications, particularly applications employing a microcontroller, or microprocessor with analog-to-digital inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. 2 Features and benefits Ideally suited for microprocessor or microcontroller-based systems Thermoplastic (PPS) surface mount package Temperature compensated over +10 °C to +60 °C Patented silicon shear stress strain gauge Available in differential and gauge configurations 3 Applications Hospital beds HVAC Respiratory systems Process control 4 Ordering information Table 1. Ordering information Type number Package Name Description MPXV7002DP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x 7.62 mm body Version SOT1693-1 MPXV7002GC SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67 mm x 10.67 mm x SOT1854-1 12.96 mm body MPXV7002GP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x SOT1693-3 8.38 mm body NXP Semiconductors MPXV7002 In...




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