SK15GH066

SK 15 GH 066 SEMITOP® 2 IGBT module SK 15 GH 066 Features* Compact design One screw mounting module Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC) 600V Trench IGBT3 technology 600V CAL IHD diode technology Integrated NTC temperature sensor UL recognized, file no. E 63 532 Typical Applications DC/DC Converter Motor Drives Welding Absolute Maximum Ratings Symbol Conditions Inverter - IGBT VCES IC Tj = 25 °C Tj = 175 °C Ts = 25 °C Ts = 70 °C ICnom ICRM VGES tpsc Tj VCC = 360 V VGE ≤ 15 V VCES ≤ 600 V Tj = 150 °C Inverse - Diode VRRM IF Tj = 25 °C Tj = 175 °C Ts = 25 °C Ts = 70 °C IFRM IFSM 10 ms, sin 180°, Tj = 150 °C Tj Module It(RMS) ∆Tterminal at PCB joint = 30 K, per pin Tstg Visol AC, sinusoidal, t = 1 min Characteristics Symbol Conditions Inverter - IGBT VCE(sat) IC = 15 A VGE = 15 V chiplevel Tj = 25 °C Tj = 150 °C VCE0 chiplevel Tj = 25 °C Tj = 150 °C rCE VGE = 15 V chiplevel Tj = 25 °C Tj = 150 °C VGE(th) VGE = VCE, IC = 0.21 mA ICES VGE = 0 V, VCE = 600 V, Tj = 25 °C Cies Coes Cres VCE = 25 V VGE = 0 V f = 1 MHz f = 1 MHz f = 1 MHz QG VGE = -8V ... +15V RGint Tj = 25 °C td(on) tr Eon td(off) tf Eoff VCC = 300 V Tj = 150 °C IC = 15 A RG on = 6.2 Ω RG off = 6.2 Ω di/dton = 1506 A/µs di/dtoff = 325 A/µs Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C VGE = +15/-8 V Tj = 150 °C Rth(j-s) per IGBT, λpaste=0.8 W/(mK) Values 600 24 20 15 30 -20 ... 20 6 -40 .....