DC-DC Converter. TPS54360 Datasheet

TPS54360 Converter. Datasheet pdf. Equivalent

TPS54360 Datasheet
Recommendation TPS54360 Datasheet
Part TPS54360
Description Step-Down DC-DC Converter
Feature TPS54360; Product Folder Order Now Technical Documents Tools & Software Support & Community Reference Des.
Manufacture etcTI
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Texas Instruments TPS54360
Product
Folder
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Now
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
TPS54360
SLVSBB4G – AUGUST 2012 – REVISED JUNE 2018
TPS54360 60-V Input, 3.5-A, Step-Down DC/DC Converter With Eco-Mode™
1 Features
1 4.5-V to 60-V (65-V Abs Max) Input Range
• 3.5-A Continuous Current, 4.5-A Minimum Peak
Inductor Current Limit
• Current Mode Control DC/DC Converter
• 92-mHigh-Side MOSFET
• High Efficiency at Light Loads with Pulse Skipping
Eco-mode™
• Low Dropout at Light Loads with Integrated BOOT
Recharge FET
• 146-μA Operating Quiescent Current
• 2-μA Shutdown Current
• 100-kHz to 2.5-MHz Fixed Switching Frequency
• Synchronizes to External Clock
• Adjustable UVLO Voltage and Hysteresis
• Internal Soft Start
• Accurate Cycle-by-Cycle Current Limit
• Thermal, Overvoltage, and Frequency Foldback
Protection
• 0.8 V 1% Internal Voltage Reference
• 8-Terminal HSOIC with PowerPAD™ Package
• –40°C to 150°C TJ Operating Range
• Create a Custom Design using the TPS54360 with
the WEBENCH® Power Designer
3 Description
The TPS54360 is a 60-V, 3.5-A, step-down regulator
with an integrated high side MOSFET. The device
survives load dump pulses up to 65 V per ISO 7637.
Current mode control provides simple external
compensation and flexible component selection. A
low ripple pulse skip mode reduces the no load
supply current to 146 μA. Shutdown supply current is
reduced to 2 μA when the enable pin is pulled low.
Undervoltage lockout is internally set at 4.3 V but can
be increased using the enable pin. The output voltage
start-up ramp is internally controlled to provide a
controlled start-up and eliminate overshoot.
A wide switching frequency range allows either
efficiency or external component size to be optimized.
Frequency foldback and thermal shutdown protect
internal and external components during an overload
condition.
The TPS54360 is available in an 8-terminal thermally
enhanced HSOIC PowerPAD™ package.
Device Information
ORDER NUMBER
PACKAGE
BODY SIZE
TPS54360
HSOIC (8)
4.89 mm × 3.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
spacer
2 Applications
12-V, 24-V and 48-V Industrial, Automotive and
Communications Power Systems
Simplified Schematic
VIN
VIN
TPS54360
EN
BOOT
RT/CLK SW
VOUT
COMP
FB
Efficiency vs Load Current
100
90
80
70
5V
3.3 V
60
50
40
VIN = 12 V
30
20
VOUT = 5 V, fsw = 600 kHz
10
VOUT = 3.3 V, fsw = 300 kHz
0
0
0.5 1.0
1.5 2.0 2.5
3.0 3.5 4.0
IO - Output Current - A
GND
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments TPS54360
TPS54360
SLVSBB4G – AUGUST 2012 – REVISED JUNE 2018
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 7
6.6 Timing Requirements ................................................ 8
6.7 Typical Characteristics .............................................. 8
7 Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 13
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 23
8 Application and Implementation ........................ 25
8.1 Application Information............................................ 25
8.2 Typical Application .................................................. 25
9 Power Supply Recommendations...................... 37
10 Layout................................................................... 38
10.1 Layout Guidelines ................................................. 38
10.2 Layout Example .................................................... 38
11 Device and Documentation Support ................. 39
11.1 Documentation Support ........................................ 39
11.2 Receiving Notification of Documentation Updates 39
11.3 Community Resources.......................................... 39
11.4 Trademarks ........................................................... 39
11.5 Electrostatic Discharge Caution ............................ 39
12 Mechanical, Packaging, and Orderable
Information ........................................................... 39
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (March 2017) to Revision G
Page
• Added top navigator icon for TI reference design ................................................................................................................. 1
• Added VBOOT clamping stipulation to Equation 2 ............................................................................................................. 15
Changes from Revision E (March 2014) to Revision F
Page
• Added the WEBENCH information in the Features, Detailed Design Procedure, and Device Support sections .................. 1
• Changed the Handling Ratings table to the ESD Ratings table ............................................................................................. 5
• Moved the Storage temperature to the Absolute Maximum Ratings table............................................................................. 5
• Changed VIN MIN Value From: 4.5 V To: VO + VDO, and added Note 1 in the Recommended Operating Conditions .......... 5
• Updated text and added Equation 1 and Equation 2 in Low Dropout Operation and Bootstrap Voltage (BOOT)............... 14
• Deleted text: "The start and stop voltage for a typical 5 V..." and Figure: "5V Start/Stop Voltage" from the Low
Dropout Operation and Bootstrap Voltage (BOOT) section ................................................................................................. 14
• Changed Equation 7 and Equation 8 ................................................................................................................................... 16
• Changed Equation 27 .......................................................................................................................................................... 26
• Added new section: Minimum VIN......................................................................................................................................... 31
• Deleted 2 graphs named "Low Dropout Operation" from the Application Curves section ................................................... 34
Changes from Revision D (February 2013) to Revision E
Page
• Changed the data sheet to the new TI layout and added the Device Information table ........................................................ 1
• Added the Handling Ratings table and Recommended Operating Conditions table.............................................................. 5
• Changed the Operating: nonswitching supply current TEST CONDITIONS From: FB = 0.83 V To: FB = 0.9 V ................. 7
• Changed RT/CLK high threshold MAX value From: 1.7 V To: 2 V ....................................................................................... 7
• Changed Figure 6 title From: HIGH FREQUENCY RANGE To: LOW FREQUENCY RANGE ............................................. 8
• Changed Figure 7 title From: LOW FREQUENCY RANGE To: HIGH FREQUENCY RANGE ............................................. 8
2
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Product Folder Links: TPS54360
Copyright © 2012–2018, Texas Instruments Incorporated



Texas Instruments TPS54360
www.ti.com
TPS54360
SLVSBB4G – AUGUST 2012 – REVISED JUNE 2018
Changes from Revision C (October 2012) to Revision D
Page
• Changed Figure 11 and Figure 12 From: IEN (µV) To: IEN (µA) .............................................................................................. 9
Changes from Revision B (September 2012) to Revision C
Page
• Changed From: 20 mV/div To: 200 mV/div in Figure 42 ...................................................................................................... 34
Changes from Revision A (September 2012) to Revision B
Page
• Changed Feature From: 1 μA Shutdown Current To: 2 μA Shutdown Current...................................................................... 1
Changes from Original (August 2012) to Revision A
Page
• Changed the device status From: Product Preview To: Production Data .............................................................................. 1
Copyright © 2012–2018, Texas Instruments Incorporated
Product Folder Links: TPS54360
Submit Documentation Feedback
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