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BAT54W Dataheets PDF



Part Number BAT54W
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description SMALL SIGNAL SCHOTTKY DIODE
Datasheet BAT54W DatasheetBAT54W Datasheet (PDF)

® BAT54J / W / AW / CW / SW SMALL SIGNAL SCHOTTKY DIODE FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT DEVICE DESCRIPTION Schottky barrier diodes encapsulated either in SOT-323 or SOD-323 small SMD packages. Single and double diodes with different pining are available. NC K K NC A A BAT54W K2 A K2 A K1 K1 BAT54AW A2 K A2 K A1 A1 BAT54CW K2 A2 K1 A2 K2 K1 A1 A1 BAT54SW SOT-323 A 86 K BAT54J SOD-32.

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® BAT54J / W / AW / CW / SW SMALL SIGNAL SCHOTTKY DIODE FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT DEVICE DESCRIPTION Schottky barrier diodes encapsulated either in SOT-323 or SOD-323 small SMD packages. Single and double diodes with different pining are available. NC K K NC A A BAT54W K2 A K2 A K1 K1 BAT54AW A2 K A2 K A1 A1 BAT54CW K2 A2 K1 A2 K2 K1 A1 A1 BAT54SW SOT-323 A 86 K BAT54J SOD-323 ABSOLUTE RATINGS (limiting values) Symbol Parameter Value VRRM Repetitive peak reverse voltage 30 IF Continuous forward current 0.3 IFSM Surge non repetitive forward current tp=10ms sinusoidal 1 Ptot Power dissipation (note 1) SOD-323 230 Tamb = 25°C SOT-323 Tstg Maximum storage temperature range - 65 to +150 Tj Maximum operating junction temperature * 150 TL Maximum temperaturefor soldering during 10s 260 Note 1: for double diodes, Ptot is the total dissipation of both diodes * : dPtot dTj < 1 Rth(j−a) thermal runaway condition for a diode on its own heatsink June 1999 - Ed: 2A Unit V A A mW °C °C °C 1/5 BAT54J / W / AW / CW / SW THERMAL RESISTANCE Symbol Parameters Rth (j-a) Junction to ambient (*) SOD-323 SOT-323 (*) Mounted on epoxy board, with recommended pad layout. Value 550 Unit °C/W °C/W STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol Parameters Tests conditions VF * Forward voltage drop Tj = 25°C IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA IR ** Reverse leakage current Tj = 25°C VR = 30 V Tj = 100°C Pulse test : * tp = 380 µs, δ < 2% ** tp = 5 ms, δ < 2% DYNAMIC CHARACTERISTICS (Tj = 25 °C) Min. Typ. Max. 240 320 400 500 900 1 100 Unit mV µA Symbol Parameters C Junction capacitance trr Reverse recovery time Tests conditions Tj = 25°C VR = 1 V F = 1 MHz Min. Typ. Max. Unit 10 pF IF = 10 mA IR = 10 mA Tj = 25°C Irr = 1 mA RL = 100 Ω 5 ns Fig. 1-1: Forward voltage drop versus forward current (typical values, low level). Fig. 1-2: Forward voltage drop versus forward current (typical values, high level). IFM(A) 2.00E-2 1.80E-2 1.60E-2 1.40E-2 1.20E-2 1.00E-2 Tj=100°C Tj=50°C Tj=25°C 8.00E-3 6.00E-3 4.00E-3 2.00E-3 VFM(V) 0.00E+0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 IFM(A) 5E-1 1E-1 Tj=100°C 1E-2 Tj=50°C Tj=25°C VFM(V) 1E-3 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 2/5 Fig. 2: Reverse leakage current versus reverse voltage applied (typical values). BAT54J / W / AW / CW / SW Fig. 3: Reverse leakage current versus junction temperature. IR(µA) 1E+2 1E+1 Tj=100°C IR(µA) 1E+4 VR=30V 1E+3 1E+2 1E+0 Tj=50°C 1E+1 1E-1 1E-2 0 1E+0 Tj=25°C 1E-1 VR(V) Tj(°C) 1E-2 5 10 15 20 25 30 0 25 50 75 100 125 150 Fig. 4: Junction capacitance versus reverse voltage applied (typical values). Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, e(Cu)=35µm) C(pF) 10 5 2 1 1 2 VR(V) 5 10 F=1MHz Tj=25°C 20 30 Zth(j-a)/Rth(j-a) 1.00 δ = 0.5 0.10 δ = 0.2 δ = 0.1 Single pulse 0.01 1E-3 1E-2 T tp(s) 1E-1 1E+0 δ=tp/T 1E+1 tp 1E+2 Fig. 6: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printedcircuit board FR4, copper thickness: 35µm.) Rth(j-a) (°C/W) 600 550 P=0.2W 500 450 400 350 300 0 S(Cu) (mm ) 5 10 15 20 25 30 35 40 45 50 3/5 BAT54J / W / AW / CW / SW PACKAGE MECHANICAL DATA SOT-323 A A1 L H θ c D b e DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.8 1.1 0.031 0.043 A1 0.0 0.1 0.0 0.004 b 0.25 0.4 0.010 0.016 c 0.1 0.26 0.004 0.010 D 1.8 2.0 2.2 0.071 0.079 0.086 E 1.15 1.25 1.35 0.045 0.049 0.053 e 0.65 0.026 H 1.8 2.1 2.4 0.071 0.083 0.094 E L 0.1 0.2 0.3 0.004 0.008 0.012 θ0 30° 0 30° 4/5 PACKAGE MECHANICAL DATA SOD-323 H b E D c Q1 L BAT54J / W / AW / CW / SW DIMENSIONS A1 REF. Millimeters Inches Min. Max. Min. Max. A 1.17 0.046 A1 0 0.1 0 0.004 A b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Ordering type Marking BAT54W D73 BAT54AW D74 BAT54CW D77 BAT54SW D78 BAT54J 86 Epoxy meets UL94,V0 Package SOT-323 SOT-323 SOT-323 SOT-323 SOD-323 Weight 0.006g 0.006g 0.006g 0.006g 0.005g Base qty 3000 3000 3000 3000 3000 Delivery mode Tape & reel Tape & reel Tape & reel Tape & reel Tape & reel Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringementof patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publicatio.


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