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1N5403G Dataheets PDF



Part Number 1N5403G
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Axial-Lead Standard Recovery Rectifier
Datasheet 1N5403G Datasheet1N5403G Datasheet (PDF)

1N5400 thru 1N5408 Axial-Lead Glass Passivated Standard Recovery Rectifiers Lead mounted standard recovery rectifiers are designed for use in power supplies and other applications having need of a device with the following features: Features • High Current to Small Size • High Surge Current Capability • Low Forward Voltage Drop • Void−Free Economical Plastic Package • Available in Volume Quantities • Plastic Meets UL 94 V−0 for Flammability • These are Pb−Free Devices Mechanical Characteristics:.

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1N5400 thru 1N5408 Axial-Lead Glass Passivated Standard Recovery Rectifiers Lead mounted standard recovery rectifiers are designed for use in power supplies and other applications having need of a device with the following features: Features • High Current to Small Size • High Surge Current Capability • Low Forward Voltage Drop • Void−Free Economical Plastic Package • Available in Volume Quantities • Plastic Meets UL 94 V−0 for Flammability • These are Pb−Free Devices Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 1.1 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Polarity: Cathode Indicated by Polarity Band *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com STANDARD RECOVERY RECTIFIERS 50−1000 VOLTS 3.0 AMPERES AXIAL LEAD CASE 267−05 STYLE 1 MARKING DIAGRAM A 1N 540x YYWWG G A = Assembly Location 1N540x = Device Number x = 0, 1, 2, 4, 6, 7 or 8 YY = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2008 1 June, 2018 − Rev. 11 Publication Order Number: 1N5400/D 1N5400 thru 1N5408 MAXIMUM RATINGS Rating Symbol 1N5400 1N5401 1N5402 1N5404 1N5406 1N5407 1N5408 Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM 50 100 200 400 600 800 1000 V VRWM VR Non−repetitive Peak Reverse Voltage VRSM 100 200 300 525 800 1000 1200 V Average Rectified Forward Current IO 3.0 A (Single Phase Resistive Load, 1/2 in. Leads, TL = 105°C) Non−repetitive Peak Surge Current IFSM 200 (one cycle) A (8 ms Single Half−Sine−Wave) Operating and Storage Junction TJ − 65 to +150 °C Temperature Range Tstg − 65 to +175 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Typ Thermal Resistance, Junction−to−Ambient (PC Board Mount, 1/2 in. Leads) RqJA 53 Unit °C/W ELECTRICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit Forward Voltage (IF = 3.0 A, TA = 25°C) vF − − 1.0 V Reverse Current (Rated DC Voltage) TA = 25°C TA = 100°C IR mA − − 10 − − 50 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Ratings at 25°C ambient temperature unless otherwise specified. 60 Hz resistive or inductive loads. For capacitive load, derate current by 20%. www.onsemi.com 2 1N5400 thru 1N5408 NOTE 1 — AMBIENT MOUNTING DATA Data shown for thermal resistance junction−to−ambient (RqJA) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. TYPICAL VALUES FOR RqJA IN STILL AIR Mounting Method 1 2 3 Lead Length, L (IN) 1/8 1/4 1/2 3/4 50 51 53 55 58 59 61 63 28 RqJA °C/W °C/W °C/W MOUNTING METHOD 1 P.C. Board Where Available Copper Surface area is small L L ÉÉÉÉÉÉÉÉÉ MOUNTING METHOD 2 Vector Push−In Terminals T−28 ÉÉÉLÉÉÉÉL ÉÉ MOUNTING METHOD 3 P.C. Board with 1−1/2” x 1−1/2” Copper Surface L = 1/2” ÉÉÉÉÉÉÉÉÉÉBoard Ground Plane www.onsemi.com 3 iF, INSTANTANEOUS FORWARD CURRENT (AMPS) 1N5400 thru 1N5408 200 TJ = 25°C 100 70 TYPICAL 50 30 20 10 7.0 5.0 IFSM, PEAK HALF WAVE CURRENT (A) 400 Surge Applied @ 300 TJ = 25°C f = 60 Hz 200 1 CYCLE 100 90 80 70 60 50 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 NUMBER OF CYCLES Figure 2. Maximum Nonrepetitive Surge Current IF(AV), AVERAGE FORWARD CURRENT (A) 3.0 2.0 1.0 0.7 0.5 0.3 0.2 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 vF, INSTANTANEOUS VOLTAGE (V) Figure 1. Forward Voltage 6 RqJA = 28°C/W 5 RqJA = 50°C/W 4 DC 3 DC 2 1 Square Wave 0 40 50 60 70 80 90 100 110 120 130 140 150 160 TA, AMBIENT TEMPERATURE (°C) Figure 4. Maximum Current Derating, Ambient, PC Board Mounting PF(AV), AVERAGE POWER DISSIPATION (W) 5 DC 4 3 Square Wave 2 1 Both Leads to Heat Sink with Lengths as Shown 1/4” L = 1/32” 1/2” 0 40 50 60 70 80 90 100 110 120 130 140 150 160 TL, LEAD TEMPERATURE (°C) Figure 3. Maximum Current Derating, Lead, Various Lengths 16 IPK/IAV = 20 10 14 12 5 Square Wave 10 dc 8 6 4 2 TJ = 25°C 0 0 1 2 3 4 5 6 7 8 9 10 IF(AV), AVERAGE FORW.


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