Document
GigaDevice Semiconductor Inc. GD32E103xx
ARM® Cortex™-M4 32-bit MCU
Datasheet
GD32E103xx Datasheet
Table of Contents
Table of Contents ........................................................................................................... 1 List of Figures ................................................................................................................ 4 List of Tables .................................................................................................................. 5 1. General description ................................................................................................. 7 2. Device overview ....................................................................................................... 8
2.1. Device information ...................................................................................................... 8 2.2. Block diagram.............................................................................................................. 9 2.3. Pinouts and pin assignment ..................................................................................... 10 2.4. Memory map .............................................................................................................. 12 2.5. Clock tree ................................................................................................................... 16 2.6. Pin definitions............................................................................................................ 16
2.6.1. GD32E103Vx LQFP100 pin definitions ................................................................................ 17 2.6.2. GD32E103Rx LQFP64 pin definitions .................................................................................. 23 2.6.3. GD32E103Cx LQFP48 pin definitions .................................................................................. 27 2.6.4. GD32E103Tx QFN36 pin definitions .................................................................................... 30
3. Functional description .......................................................................................... 33 3.1. ARM® Cortex™-M4 core ............................................................................................ 33 3.2. On-chip memory ........................................................................................................ 33 3.3. Clock, reset and supply management...................................................................... 34 3.4. Boot modes................................................................................................................ 34 3.5. Power saving modes ................................................................................................. 35 3.6. Analog to digital converter (ADC) ............................................................................ 35 3.7. Digital to analog converter (DAC)............................................................................. 36 3.8. DMA ............................................................................................................................ 36 3.9. General-purpose inputs/outputs (GPIOs) ................................................................ 36 3.10. Timers and PWM generation ................................................................................. 37 3.11. Real time clock (RTC) ............................................................................................ 38 3.12. Inter-integrated circuit (I2C) .................................................................................. 38 3.13. Serial peripheral interface (SPI) ............................................................................ 38 3.14. Universal synchronous asynchronous receiver transmitter (USART) ............... 39
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GD32E103xx Datasheet
3.15. Inter-IC sound (I2S) ................................................................................................ 39 3.16. Universal serial bus full-speed interface (USBFS)............................................... 39 3.17. Controller area network (CAN) .............................................................................. 40 3.18. External memory controller (EXMC) ..................................................................... 40 3.19. Debug mode ........................................................................................................... 40 3.20. Package and operation temperature..................................................................... 40 4. Electrical characteristics....................................................................................... 42 4.1. Absolute maximum ratings ....................................................................................... 42 4.2. Operating conditions characteristics....................................................................... 42 4.3. Power consumption .............................................