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CD74HC367E Dataheets PDF



Part Number CD74HC367E
Manufacturers Texas Instruments
Logo Texas Instruments
Description Three-State Non-Inverting and Inverting
Datasheet CD74HC367E DatasheetCD74HC367E Datasheet (PDF)

CD54HC367, CD74HC367, CD54HCT367 CD74HCT367, CD54HC368, CD74HC368, CD74HCT368 SCHS181E – NOVEMBER 1997 – REVISED FEBRUARY 2022 CDx4HC367, CDx4HC368, CDx4HCT367, CD74HCT368 High-Speed CMOS Logic Hex Buffer/Line Driver, Three-State Non-Inverting and Inverting 1 Features • Buffered inputs • High current bus driver outputs • Two independent three-state enable controls • Typical propagation delay tPLH, tPHL = 8 ns at VCC = 5 V, CL =15 pF, TA = 25℃ • Fanout (over temperature range) – Standard outputs.

  CD74HC367E   CD74HC367E


Document
CD54HC367, CD74HC367, CD54HCT367 CD74HCT367, CD54HC368, CD74HC368, CD74HCT368 SCHS181E – NOVEMBER 1997 – REVISED FEBRUARY 2022 CDx4HC367, CDx4HC368, CDx4HCT367, CD74HCT368 High-Speed CMOS Logic Hex Buffer/Line Driver, Three-State Non-Inverting and Inverting 1 Features • Buffered inputs • High current bus driver outputs • Two independent three-state enable controls • Typical propagation delay tPLH, tPHL = 8 ns at VCC = 5 V, CL =15 pF, TA = 25℃ • Fanout (over temperature range) – Standard outputs: 10 LSTTL Loads – Bus driver outputs: 15 LSTTL Loads • Wide operating temperature range: -55℃ to 125℃ • Balanced propagation delay and transition times • Significant power reduction compared to LSTTL Logic ICs • HC Types – 2 V to 6 V operation – High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5 V • HCT Types – 4.5 V to 5.5 V operation – Direct LSTTL input logic compatibility, VIL = 0.8 V (Max), VIH = 2 V (Min) – CMOS input compatibility, II ≤ 1 μA at VOL, VOH 1 1OE 2 Description The ’HC367, ’HCT367, ’HC368, and CD74HCT368 silicon gate CMOS three-state buffers are general purpose high-speed non-inverting and inverting buffers. The ’HC367 and ’HCT367 are non-inverting buffers, whereas the ’HC368 and CD74HCT368 are inverting buffers. They have high drive current outputs which enable high speed operation even when driving large bus capacitances. These circuits possess the low power dissipation of CMOS circuitry, yet have speeds comparable to low power Schottky TTL circuits. Both circuits are capable of driving up to 15 low power Schottky inputs. PART NUMBER Device Information PACKAGE(1) BODY SIZE (NOM) CD74HC367M SOIC (16) 9.90 mm × 3.90 mm CD74HC368M SOIC (16) 9.90 mm × 3.90 mm CD74HCT367M SOIC (16) 9.90 mm × 3.90 mm CD74HCT368M SOIC (16) 9.90 mm × 3.90 mm CD74HC367E PDIP (16) 19.31 mm × 6.35 mm CD74HC368E PDIP (16) 19.31 mm × 6.35 mm CD74HCT367E PDIP (16) 19.31 mm × 6.35 mm CD74HCT368E PDIP (16) 19.31 mm × 6.35 mm CD54HC367F3A CDIP (16) 24.38 mm × 6.92 mm CD54HC368F3A CDIP (16) 24.38 mm × 6.92 mm CD54HCT367F3A CDIP (16) 24.38 mm × 6.92 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 15 2OE 2 1A1 4 1A2 6 1A3 3 1Y1 5 1Y2 7 1Y3 12 2A1 14 2A2 11 2Y1 13 2Y2 9 1A4 10 1Y4 Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CD54HC367, CD74HC367, CD54HCT367 CD74HCT367, CD54HC368, CD74HC368, CD74HCT368 SCHS181E – NOVEMBER 1997 – REVISED FEBRUARY 2022 www.ti.com Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings........................................ 4 5.2 Recommended Operating Conditions.........................4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Switching Characteristics............................................6 6 Parameter Measurement Information............................ 7 7 Detailed Description........................................................8 7.1 Overview..................................................................... 8 7.2 Functional Block Diagram........................................... 8 7.3 Device Functional Modes............................................8 8 Power Supply Recommendations..................................9 9 Layout...............................................................................9 9.1 Layout Guidelines....................................................... 9 10 Device and Documentation Support..........................10 10.1 Receiving Notification of Documentation Updates..10 10.2 Support Resources................................................. 10 10.3 Trademarks............................................................. 10 10.4 Electrostatic Discharge Caution..............................10 10.5 Glossary..................................................................10 11 Mechanical, Packaging, and Orderable Information.................................................................... 10 3 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (October 2003) to Revision E (February 2022) Page • Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect modern da.


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