Document
CD54HC367, CD74HC367, CD54HCT367 CD74HCT367, CD54HC368, CD74HC368, CD74HCT368
SCHS181E – NOVEMBER 1997 – REVISED FEBRUARY 2022
CDx4HC367, CDx4HC368, CDx4HCT367, CD74HCT368 High-Speed CMOS Logic Hex Buffer/Line Driver, Three-State Non-Inverting and Inverting
1 Features
• Buffered inputs • High current bus driver outputs • Two independent three-state enable controls • Typical propagation delay tPLH, tPHL = 8 ns
at VCC = 5 V, CL =15 pF, TA = 25℃ • Fanout (over temperature range)
– Standard outputs: 10 LSTTL Loads – Bus driver outputs: 15 LSTTL Loads • Wide operating temperature range: -55℃ to 125℃ • Balanced propagation delay and transition times • Significant power reduction compared to LSTTL Logic ICs • HC Types – 2 V to 6 V operation – High noise immunity: NIL = 30%,
NIH = 30% of VCC at VCC = 5 V • HCT Types
– 4.5 V to 5.5 V operation – Direct LSTTL input logic compatibility,
VIL = 0.8 V (Max), VIH = 2 V (Min) – CMOS input compatibility, II ≤ 1 μA at VOL, VOH
1 1OE
2 Description
The ’HC367, ’HCT367, ’HC368, and CD74HCT368 silicon gate CMOS three-state buffers are general purpose high-speed non-inverting and inverting buffers. The ’HC367 and ’HCT367 are non-inverting buffers, whereas the ’HC368 and CD74HCT368 are inverting buffers. They have high drive current outputs which enable high speed operation even when driving large bus capacitances. These circuits possess the low power dissipation of CMOS circuitry, yet have speeds comparable to low power Schottky TTL circuits. Both circuits are capable of driving up to 15 low power Schottky inputs.
PART NUMBER
Device Information
PACKAGE(1) BODY SIZE (NOM)
CD74HC367M
SOIC (16) 9.90 mm × 3.90 mm
CD74HC368M
SOIC (16) 9.90 mm × 3.90 mm
CD74HCT367M
SOIC (16) 9.90 mm × 3.90 mm
CD74HCT368M
SOIC (16) 9.90 mm × 3.90 mm
CD74HC367E
PDIP (16) 19.31 mm × 6.35 mm
CD74HC368E
PDIP (16) 19.31 mm × 6.35 mm
CD74HCT367E
PDIP (16) 19.31 mm × 6.35 mm
CD74HCT368E
PDIP (16) 19.31 mm × 6.35 mm
CD54HC367F3A
CDIP (16) 24.38 mm × 6.92 mm
CD54HC368F3A
CDIP (16) 24.38 mm × 6.92 mm
CD54HCT367F3A CDIP (16) 24.38 mm × 6.92 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
15 2OE
2 1A1
4 1A2
6 1A3
3 1Y1
5 1Y2
7 1Y3
12 2A1
14 2A2
11 2Y1
13 2Y2
9 1A4
10 1Y4
Functional Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
CD54HC367, CD74HC367, CD54HCT367 CD74HCT367, CD54HC368, CD74HC368, CD74HCT368
SCHS181E – NOVEMBER 1997 – REVISED FEBRUARY 2022
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Table of Contents
1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4 5.2 Recommended Operating Conditions.........................4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Switching Characteristics............................................6 6 Parameter Measurement Information............................ 7 7 Detailed Description........................................................8 7.1 Overview..................................................................... 8
7.2 Functional Block Diagram........................................... 8 7.3 Device Functional Modes............................................8 8 Power Supply Recommendations..................................9 9 Layout...............................................................................9 9.1 Layout Guidelines....................................................... 9 10 Device and Documentation Support..........................10 10.1 Receiving Notification of Documentation Updates..10 10.2 Support Resources................................................. 10 10.3 Trademarks............................................................. 10 10.4 Electrostatic Discharge Caution..............................10 10.5 Glossary..................................................................10 11 Mechanical, Packaging, and Orderable Information.................................................................... 10
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2003) to Revision E (February 2022)
Page
• Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect modern da.