Voltage Regulator. LM2674M-3.3 Datasheet

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LM2674M-3.3 Datasheet
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Part LM2674M-3.3
Description 500-mA Step-Down Voltage Regulator
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LM2674
SNVS007G – SEPTEMBER 1998 – REVISED JUNE 2016
LM2674 SIMPLE SWITCHER® Power Converter High Efficiency
500-mA Step-Down Voltage Regulator
1 Features
1 Efficiency up to 96%
• Available in 8-Pin SOIC, PDIP, and 16-Pin WSON
Packages
• Simple and Easy to Design With
• Requires Only 5 External Components
• Uses Readily Available Standard Inductors
• 3-V, 5-V, 12-V, and Adjustable Output Versions
• Adjustable Version Output Voltage Range: 1.21 V
to 37 V
• ±1.5% Maximum Output Voltage Tolerance Over
Line and Load Conditions
• Ensured 500-mA Output Load Current
• 0.25-DMOS Output Switch
• Wide Input Voltage Range: 8 V to 40 V
• 260-kHz Fixed Frequency Internal Oscillator
• TTL Shutdown Capability, Low Power Standby
Mode
• Thermal Shutdown and Current Limit Protection
2 Applications
• Simple High Efficiency (>90%) Step-Down (Buck)
Regulators
• Efficient Preregulator for Linear Regulators
• Positive-to-Negative Converters
3 Description
The LM2674 series of regulators are monolithic
integrated circuits built with a LMDMOS process.
These regulators provide all the active functions for a
step-down (buck) switching regulator, capable of
driving a 500-mA load current with excellent line and
load regulation. These devices are available in fixed
output voltages of 3.3 V, 5 V, 12 V, and an adjustable
output version.
Requiring a minimum number of external
components, these regulators are simple to use and
include patented internal frequency compensation
and a fixed frequency oscillator.
The LM2674 series operates at a switching frequency
of 260 kHz, thus allowing smaller sized filter
components than what is required with lower
frequency switching regulators. Because of its very
high efficiency (>90%), the copper traces on the
printed-circuit board are the only heat sinking
required.
A family of standard inductors for use with the
LM2674 are available from several different
manufacturers. This feature greatly simplifies the
design of switch-mode power supplies using these
advanced ICs. Also included in the data sheet are
selector guides for diodes and capacitors designed to
work in switch-mode power supplies.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
LM2674
PDIP (8)
9.81 mm × 6.35 mm
WSON (16)
5.00 mm × 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments LM2674M-3.3
LM2674
SNVS007G – SEPTEMBER 1998 – REVISED JUNE 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 3
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics – 3.3-V Version................. 5
7.6 Electrical Characteristics – 5-V Version.................... 5
7.7 Electrical Characteristics – 12-V Version.................. 5
7.8 Electrical Characteristics – Adjustable Voltage
Version ....................................................................... 6
7.9 Electrical Characteristics – All Output Voltage
Versions ..................................................................... 6
7.10 Typical Characteristics ............................................ 7
8 Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 11
9 Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Applications ................................................ 13
10 Power Supply Recommendations ..................... 24
11 Layout................................................................... 25
11.1 Layout Guidelines ................................................. 25
11.2 Layout Examples................................................... 25
12 Device and Documentation Support ................. 27
12.1 Documentation Support ........................................ 27
12.2 Receiving Notification of Documentation Updates 27
12.3 Community Resources.......................................... 27
12.4 Trademarks ........................................................... 27
12.5 Electrostatic Discharge Caution ............................ 27
12.6 Glossary ................................................................ 27
13 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (April 2013) to Revision G
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
• Removed all references to Computer Design Software LM267X Made Simple (Version 6.0).............................................. 1
Changes from Revision E (April 2013) to Revision F
Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 25
2
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Copyright © 1998–2016, Texas Instruments Incorporated



Texas Instruments LM2674M-3.3
www.ti.com
LM2674
SNVS007G – SEPTEMBER 1998 – REVISED JUNE 2016
5 Description (continued)
Other features include an ensured ±1.5% tolerance on output voltage within specified input voltages and output
load conditions, and ±10% on the oscillator frequency. External shutdown is included, featuring typically 50-μA
standby current. The output switch includes current limiting, as well as thermal shutdown for full protection under
fault conditions.
6 Pin Configuration and Functions
D or P Package
8-Pin SOIC or PDIP
Top View
NHN Package
16-Pin WSON
Top View
CB 1
8
NC 2
7
NC 3
6
FB 4
5
Not to scale
VSW
VIN
GND
ON/OFF
CB 1
NC 2
NC 3
NC 4
NC 5
NC 6
NC 7
FB 8
DAP
16 VSW
15 VSW
14 VIN
13 NC
12 GND
11 GND
10 NC
9 ON/OFF
Not to scale
Connect DAP to pin 11 and 12.
NAME
CB
FB
ON/OFF
VSW
GND
VIN
NC
PIN
SOIC, PDIP
1
WSON
1
4
8
5
9
8
15, 16
6
11, 12
7
14
2, 3
2, 3, 4, 5, 6,
7, 10, 13
Pin Functions
I/O
DESCRIPTION
I
Bootstrap capacitor connection for high-side driver. Connect a high-quality, 470-nF
capacitor from CB to VSW Pin.
Feedback sense input pin. Connect to the midpoint of feedback divider to set VOUT
I for ADJ version or connect this pin directly to the output capacitor for a fixed output
version.
I
Enable input to the voltage regulator. High = ON and low = OFF. Pull this pin high or
float to enable the regulator
O
Source pin of the internal high-side FET. This is a switching node. Attached this pin
to an inductor and the cathode of the external diode
Power ground pins. Connect to system ground. Ground pins of CIN and COUT. Path
to CIN must be as short as possible.
Supply input pin to collector pin of high-side FET. Connect to power supply and
I input bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and
GND must be as short as possible.
— No connect pins
Copyright © 1998–2016, Texas Instruments Incorporated
Product Folder Links: LM2674
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