TN1258

TN1258 Technical note An innovative high power IC surface mount package family: PowerSO-20 & PowerSO-36 Power IC packaging from insertion to surface mounting Introduction An innovative, high power IC surface mount package family is introduced in this note. It is called PowerSO family and has the Jedec registration MO-166. STMicroelectronics developed PowerSO in order to answer the increasing demand of miniaturization and quality in power applications. Automotive, industrial, audio and telecom markets will take advantage of the new package, by introducing the use of Surface Mount Technology in the production of power systems. PowerSO-20 and PowerSO-36 are the elements of the MO-166 family having 20 leads at 0.050 inch pitch (1.27 mm) and 36 leads at 0.026 inch pitch (0.65 mm) respectively. These packages are in mass production since 1995. This note is intended to compare the PowerSO-20/36 with alternative surface mount solutions and to the existing Multiwatt package, the well known "double TO-220" developed by STMicroelectronics in late 70s. Data presented here demonstrates that PowerSO-20 is the real successor of Multiwatt for surface mount applications and becomes a milestone in power package technology with PowerSO-36 as Multiwatt did 30 years ago. Figure 1: PowerSO-20 – Jedec registration MO-166 November 2017 DocID031323 Rev 1 GADG0711171203PS 1/33 www.st.com Contents Contents TN1258 1 Power devices and surface mounting............................................ 5 1...