Document
VRSM = 400 V, IF(AV) = 2.0 A General-purpose Rectifier Diode
SJPM-H4
Data Sheet
Description
The SJPM-H4 is a 400 V, 2.0 A general-purpose rectifier diode with low loss characteristics. This rectifier diode is for a commercial power supply.
Features
● VRSM -------------------------------------------------- 400 V ● IF(AV)---------------------------------------------------- 2.0 A ● VF (IF = 2.0 A) --------------------------------- 0.94 V typ. ● Bare Lead Frame: Pb-free (RoHS Compliant) ● Flammability: Equivalent to UL94V-0 ● Suitable for High Reliability and Automotive
Requirement
Applications
● Rectification Circuit ● Reverse Battery Protection Circuit
Package
SJP
(1) (1)
Cathode Mark (2)
(2)
(1) Cathode
(2) Anode
Not to scale
SJPM-H4-DSE Rev.1.3
SANKEN ELECTRIC CO., LTD.
1
Mar. 09, 2021
https://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2008
SJPM-H4
Absolute Maximum Ratings
Unless otherwise specified, TA = 25 °C.
Parameter
Symbol
Conditions
Rating
Unit
Nonrepetitive Peak Reverse Voltage VRSM
400
V
Repetitive Peak Reverse Voltage
VRM
400
V
Average Forward Current
IF(AV) See Figure 2 and Figure 3
2.0
A
Surge Forward Current
IFSM
Half cycle sine wave, positive side, 10 ms, 1 shot
45
A
I2t Limiting Value
I2t 1 ms ≤ t ≤ 10ms
10.1
A2s
Junction Temperature
TJ
− 40 to 150
°C
Storage Temperature
TSTG
− 40 to 150
°C
Electrical Characteristics
Unless otherwise specified, TA = 25 °C.
Parameter
Symbol
Conditions
Forward Voltage Drop
VF IF = 2.0 A
Reverse Leakage Current
Reverse Leakage Current under High Temperature Thermal Resistance(1)
IR H∙IR Rth(J-L)
VR = VRM VR = VRM, TJ = 150 °C
Min. Typ. Max. Unit
—
0.94 1.10
V
—
—
10
µA
—
—
50
µA
—
—
20 °C/W
Mechanical Characteristics
Parameter Package Weight
Conditions
TL Device
TA
Min.
Typ.
Max.
Unit
―
0.072
―
g
1.6 mm
2 mm
Copper Area
25 mm
2 mm
2 mm
Substrate
25 mm
Figure 1. Lead Temperature Measurement Conditions
(1) Rth (J-L) is thermal resistance between junction and lead. Lead temperature (TL) is measured near the root of pin (see Figure 1).
SJPM-H4-DSE Rev.1.3
SANKEN ELECTRIC CO., LTD.
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Mar. 09, 2021
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© SANKEN ELECTRIC CO., LTD. 2008
Average Forward Current, IF(AV) (A) Average Forward Current, IF(AV) (A)
SJPM-H4 Derating Curves
2.0
DC t/T = 1/2 1.5
t/T = 1/3, sine wave 1.0
t/T = 1/6
0.5
t
T
0.0
50
75
100
125
150
Lead Temperature, TL (°C)
Figure 2. IF(AV) vs. TL (TJ = 150 °C, VR = 0 V)
2.0
DC t/T = 1/2 1.5
t/T = 1/3, sine wave 1.0
t/T = 1/6
0.5
t
T
0.0
50
75
100
125
150
Lead Temperature, TL (°C)
Figure 3. IF(AV) vs. TL (TJ = 150 °C, VR = 400 V)
SJPM-H4-DSE Rev.1.3
SANKEN ELECTRIC CO., LTD.
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Mar. 09, 2021
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© SANKEN ELECTRIC CO., LTD. 2008
Maximum Forward Power Dissipation, PF(MAX) (W)
SJPM-H4 Characteristic Curves
3.0
t T
2.0
t/T = 1/6
t/T = 1/3, sine wave
1.0
t/T = 1/2
DC
0.0
0.0
0.5
1.0
1.5
2.0
Average Forward Current, IF(AV) (A)
Figure 4. PF(MAX) vs. IF(AV) (TJ = 150 °C)
10
Forward Current, IF (A)
1
TJ = 150 °C 0.1
TJ = 100 °C 0.01
TJ = 25 °C
0.001
0.0
0.5
1.0
1.5
Forward Voltage Drop, VF (V) Figure 6. Typical Characteristics: IF vs. VF
Reverse Leakage Current, IR (A)
Maximum Reverse Power Dissipation, PR(MAX) (W)
0.02
t T
0.015
1−t/T = 5/6
0.01 0.005
1−t/T = 2/3 1−t/T = 1/2
Sine wave
0
0
100
200
300
400
Reverse Voltage, VR (V)
Figure 5. PR(MAX) vs. VR (TJ = 150 °C)
1.E-05
1.E-06 1.E-07
TJ = 150 °C
1.E-08 1.E-09
TJ = 100 °C TJ = 25 °C
1.E-10 0
100
200
300
400
Reverse Voltage, VR (V)
Figure 7. Typical Characteristics: IR vs. VR
SJPM-H4-DSE Rev.1.3
SANKEN ELECTRIC CO., LTD.
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Mar. 09, 2021
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© SANKEN ELECTRIC CO., LTD. 2008
SJPM-H4
1000 100
10
Rth(J-A) Rth(J-L)
Thermal Resistance (°C/W)
1
0.1 10m
100m
1
10
Pulse Width (s)
100
1000
Figure 8. Typical Transient Thermal Resistance Characteristics
SJPM-H4-DSE Rev.1.3
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SJPM-H4 Physical Dimensions
● SJP Package
4.5±0.2
2.6±0.2
+0.1 -0.05
+0.1 -0.2
0.05
2.15
1.3±0.4 2.0min. 1.3±0.4
1.5±0.2
NOTES:
5.0
+0.4 -0.1
- Dimensions in millimeters - Bare lead frame: Pb-free (RoHS compliant) - Moisture Sensitivity Level 1 (MSL 1) - When soldering the products, be sure to minimize the working time within the following limits: - Flow: 260 °C / 10 s, 1 time
Reflow: Preheat: 150 °C to 200 °C / 60 s to 120 s Solder heating: 255 °C / 30 s, 3 times (260 °C peak)
- Soldering Iron: 350 °C / 3.5 s, 1 time
● SJP Land Pattern Example
2.0
2.0 4.0 to 4.2
NOTE: - Dimensions in millimeters
SJPM-H4-DSE Rev.1.3
SANKEN ELECTRIC CO., LTD.
6
Mar. 09, 2021
https://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2008
SJPM-H4 Mark.