prototyping controller. B-Box_RCP Datasheet

B-Box_RCP controller. Datasheet pdf. Equivalent

B-Box_RCP Datasheet
Recommendation B-Box_RCP Datasheet
Part B-Box_RCP
Description Rapid prototyping controller
Feature B-Box_RCP; B-Box RCP  3.0 Rapid prototyping controller The B-Box RCP accelerates the development and experiment.
Manufacture imperix
Datasheet
Download B-Box_RCP Datasheet




imperix B-Box_RCP
B-Box RCP3.0
Rapid prototyping controller
The B-Box RCP accelerates the development
and experimental validation of converter control
techniques in a laboratory environment.
GENERAL DESCRIPTION
B-Box RCP is a modular control platform, exclusively tailored
for Rapid Control Prototyping (RCP) applications in power
electronics. Thanks to its high performance and flexibility, it
facilitates the experimental validation of power converters
control techniques in R&D environments.
The B-Box notably distinguishes from other RCP solutions
by its fully programmable analog front-end, its advanced
Pulse-Width Modulation (PWM) capabilities, as well as its
numerous and specialized I/Os.
Also, this system has been designed from the start with syn-
chronous sampling applications in mind. It therefore offers
a large configurability and guarantees a very strict man-
agement of timings and phase shifts, from analog inputs
to PWM outputs, including in networked configurations.
Performance is not left on the side either, since its dual-core
ARM processor and Kintex-grade FPGA support closed loop
control application up to hundreds of kHz ! Besides, for the
most demanding applications, B-Boxes can be stacked up
forming a networked control system of up to 64 units and
thousands of I/Os.
Networked B-Box configurations are supported by RealSync,
a proprietary technology that guarantees sub-μs transfer
latency and ns-scale synchronization accuracy. Thanks to
this technology, stacked configurations can be used in a
totally transparent fashion, as if all FPGA resources and I/Os
belonged to one single controller.
TYPICAL APPLICATIONS
Thanks to its high flexibility, practically any power electronic
application can be ideally addressed with B-Box RCP, rang-
ing from grid-tied appliances to electric drives, energy stor-
age systems, renewables, electric mobility, etc.
That said, B-Box RCP is most attractive in demanding appli-
cations, either in terms of I/O count (e.g. multilevel convert-
ers), in terms of performance or even both. Notably, systems
based on wide band gap devices such as SiC or GaN often
simultaneously require high-precision PWM generation as
well as a fast closed-loop control speed.
KEY FEATURES AND SPECIFICATIONS
» Stackable up to 64 units
» Dual-core 1 GHz ARM processor
» Kintex-grade FPGA (user programmable)
» Software-independent protections
» Programmable analog front-end
» Up to 250 kHz closed loop control frequency
» 134 user I/Os per unit
» Advanced pulse-width modulators (PWM)
P. 1/17 – Rev. 11/30/20



imperix B-Box_RCP
FRONT PANEL
•••••••••••
B-Box 3.0
ETHERNET
USB
CONFIG. & STATUS
12
34
1) Gigabit Ethernet port (RJ45)
2) Front panel USB port
3) Rotary and push button
4) LCD screen
ANALOG INPUTS
CORE
SYNC
USER
A0 A1 A2 A3
0/8 1/9 2/10 3/11 4/12 5/13 6/14 7/15
D0 D1 D2 D3 D4 D5 D6 D7
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
56
7
8
Fig. 1.  Front panel view of the B-Box RCP.
5) System and user LEDs
6) Analog outputs (SMA, ±5 V)
7) Analog inputs (RJ45, ±10 V)
8) Optical PWM outputs (PWM lanes #0-#15)
BACK PANEL
1
2
3
45
6
7
8
9 10 11
12
Fig. 2.  Back panel view of the B-Box RCP.
1) AC mains switch (ON/OFF)
2) AC mains socket (IEC C14, 110-230 V)
3) Fan outlets
4) Selector for GPI/GPO voltage (3.3 V or 5.0 V)
5) Digital inputs – Connectors A and B (VHDCI HD68)
6) Digital outputs – Connectors C and D (VHDCI HD68)
7) Electrical interlock connector (IN/OUT)
8) Console port (system debug)
9) SFP interconnect – UP link
10) Optical interlock (IN/OUT)
11) SFP interconnect – DOWN links
12) CAN socket (RJ45)
DEVICE CONTENT
12
3
4
5
Zynq
DIO DIO DIO DIO
Artix
MCU
ETH USB LCD
ADC
Con gurable
analog front-end
LED AIN
ADC
Con gurable
analog front-end
DAC AIN
POF
6
1) SFP Interconnect – DOWN links
2) SFP Interconnect – UP link
3) B-Board processing module
4) Auxiliary FPGA
7
7
8
Fig. 3.  Simplified system description of the B-Box RCP.
5) Digital inputs & outputs
6) Frontpanel micro controller
7) Analog front-end board(s)
8) Plastic Optical Fiber (POF) output module
P. 2/17 – Rev. 11/30/20



imperix B-Box_RCP
B-BOARD PROCESSING MODULE DESCRIPTION
11 2
3 45
1) SFP Interconnect
– DOWN links
2) SFP Interconnect
– UP link
3) USB OTG
(on bottom BSH)
4) Gigabit Ethernet
(on bottom BSH)
5) Console port
CLK
XO
GEN
6x LED
PSU
4.5-17V input range
BSH 180 pins
USB
USB
PHY
ETH
PHY
FTDI
Zynq
XC7Z030-3
FBG676
BSH 180 pins
SD
Flash
eMMC
DDR3L
DDR3L
6
6) Onboard memories :
– SD card slot
– 32 MB Flash (program)
– 8 GB Flash (logging)
7) Wide input range on-
board power supply
8) SFP clocks management
9) DDR memory (1 GB)
7
8
9
Fig. 4.  Simplified structure of the B-Board processing module.
MAIN SPECIFICATIONS
Component
System on chip
Processing system
Programmable logic (FPGA)
Storage
Specification
Xilinx Zynq XC7Z030-3FBG676E
Speed grade -3
ARM Cortex A9 1 Ghz x2
1GB DDR3
Kintex 7 125K
Artix 7 35T (auxiliary)
Flash 16MB x2
micro SD + eMMC 8GB
Communication
USB 2.0 high speed (type A) x1
USB console x1
Ethernet 1Gbps (RJ45) x1
SFP+ 5Gbps x3
Component
PWM outputs
Analog inputs
General-purpose digital outputs (GPO)
General-purpose digital inputs (GPI)
Incremental decoder inputs
User High-speed I/Os
Fault inputs / outputs
Table 1.  Main system specifications for B-Box RCP.
Specification
Various modulators
4 ns resolution
Optical 50 Mbps x16
Electrical (3V3) x32
16 bits / 500ksps (simultaneous) x16
Fully configurable front-end
Electrical (3.3V/5.0V) x16
Electrical (3.3V/5.0V) x16
3-pins (A,B,Z) x4
Shared with GPI inputs
FPGA direct (3V3) x36
Digital (3V3) x16
Optical interlock x1
Electrical interlock (5.0V) x1
MAXIMUM I/O CAPABILITIES
Component
Analog inputs
PWM outputs
Characteristics
Fully configurable (gain, impedance, filter, protection)
Optical, 50 Mbps
Single (1 unit)
16
16
Electrical, >500 Mbps
32
General-purpose digital outputs (GPO)
Electrical, >100 Mbps
16
General-purpose digital inputs (GPI)
Electrical, >100 Mbps
16
Table 2.  Maximum I/O count per B-Box RCP unit and in networked configuration.
Stacked (64 units)
1024
1024
2048
1024
1024
P. 3/17 – Rev. 11/30/20





@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)