Pressure Sensor. MPXV7002GC Datasheet

MPXV7002GC Sensor. Datasheet pdf. Equivalent

MPXV7002GC Datasheet
Recommendation MPXV7002GC Datasheet
Part MPXV7002GC
Description Integrated Silicon Pressure Sensor
Feature MPXV7002GC; MPXV7002 Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated a.
Manufacture NXP
Datasheet
Download MPXV7002GC Datasheet





NXP MPXV7002GC
MPXV7002
Integrated silicon pressure sensor, on-chip signal
conditioned, temperature compensated and calibrated
Rev. 5 — 5 May 2021
Product data sheet
1 General description
The MPXV7002 series piezoresistive transducers are monolithic silicon pressure
sensors. The MPXV7002 is designed for a wide range of applications, particularly
applications employing a microcontroller, or microprocessor with analog-to-digital inputs.
This transducer combines advanced micromachining techniques, thin-film metallization,
and bipolar processing to provide an accurate, high-level analog output signal that is
proportional to the applied pressure.
2 Features and benefits
Ideally suited for microprocessor or microcontroller-based systems
Thermoplastic (PPS) surface mount package
Temperature compensated over +10 °C to +60 °C
Patented silicon shear stress strain gauge
Available in differential and gauge configurations
3 Applications
Hospital beds
HVAC
Respiratory systems
Process control
4 Ordering information
Table 1. Ordering information
Type number Package
Name Description
MPXV7002DP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x
7.62 mm body
Version
SOT1693-1
MPXV7002GC SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67 mm x 10.67 mm x SOT1854-1
12.96 mm body
MPXV7002GP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x SOT1693-3
8.38 mm body



NXP MPXV7002GC
NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated
4.1 Ordering options
Table 2. Ordering options
Device name
Package
options
SOT
no.
# of Ports
None Single Dual
Small Outline Package (MPXV7002 Series)
MPXV7002DP
Trays SOT1693-1
MPXV7002DPT1 Tape & Reel SOT1693-1
MPXV7002GC6U
Rails
SOT1854-1
MPXV7002GP
Trays SOT1693-3
Pressure type
Gauge Differential Absolute
Device
marking
MPXV7002DP
MPXV7002DP
MPXV7002G
MPXV7002G
Small outline packages
MPXV7002DP/DPT1
CASE 1351-01
SOT1693-1
5 Block diagram
MPXV7002GC6U/C6T1
CASE 482A-01
SOT1854-1
VS
2
MPXV7002GP
CASE 1369-01
SOT1693-3
Sensing
element
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
4
Vout
3
GND
Pins 1, 5, 6, 7 and 8 are NO CONNECTS
for small outline package device
Figure 1. Integrated pressure sensor schematic
aaa-040606
MPXV7002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 5 May 2021
© NXP B.V. 2021. All rights reserved.
2 / 18



NXP MPXV7002GC
NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated
6 Pinning information
6.1 Pinning
5
4
5
6
3
6
7
2
7
8
1
8
4
5
4
3
6
3
2
7
2
1
8
1
aaa-040604
aaa-037858
Figure 2. MPXV7002DP/DPT1 pin
diagram
aaa-037857
Figure 3. MPXV7002GC6U/C6T1 pin Figure 4. MPXV7002GP pin diagram
diagram
6.2 Pin description
This device family uses the style 2 pin configuration documented in Table 3 and shown in
Figure 10.
Table 3. Pin description
Symbol Pin[1] Description
n.c.
1
[2]
Vs
2
GND
3
Supply voltage
Ground
Vout
4
Voltage output
n.c.
5
[2]
n.c.
6
[2]
n.c.
7
[2]
n.c.
8
[2]
[1] The notch in the lead indicates pin 1.
[2] Internal device connection. Do not connect to external circuitry or ground
7 Maximum Ratings
Table 4. Maximum Ratings[1]
Rating
Maximum pressure (P1 > P2)
Storage temperature
Operating temperature
Symbol
Pmax
Tstg
TA
Value
75
–30 to +100
10 to 60
Unit
kPa
°C
°C
[1] Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor
chip.
MPXV7002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 5 May 2021
© NXP B.V. 2021. All rights reserved.
3 / 18





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