CD4041UBF

Data sheet acquired from Harris Semiconductor SCHS039C – Revised September 2003 The CD4041UB types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright © 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) CD4041UBE CD4041UBF CD4041UBF3A CD4041UBM CD4041UBM96 CD4041UBMT CD4041UBPW CD4041UBPWR ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE PDIP CDIP CDIP SOIC SOIC SOIC TSSOP TSSOP N 14 25 RoHS & Green J 14 1 Non-RoHS & Green J 14 1 Non-RoHS & Green D 14 50 RoHS & Green D 14 2500 RoHS & Green D 14 250 RoHS & Green PW 14 90 RoHS & Green PW 14 2000 RoHS & Green Lead finish/ Ball material (6) NIPDAU SNPB SNPB NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU MSL Peak Temp Op Temp (°C) (3) N / A for Pkg Type N / A for Pkg Type -55 to 125 -55 to 125 N / A for Pkg Type -55 to 125 Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 Device Marking (4/5) CD4041UBE CD4041UBF CD4041UBF3A CD4041UBM CD4041UBM CD4041UBM CM041UB CM041UB (1) The marketing status values are defined as follows: ACTIVE: Product...