CD4001UBF3A

Data sheet acquired from Harris Semiconductor SCHS016C – Revised September 2003 The CD4001UB types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright © 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) CD4001UBE CD4001UBEE4 CD4001UBF CD4001UBF3A CD4001UBM CD4001UBM96 CD4001UBPW CD4001UBPWR CD4001UBPWRG4 ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE PDIP PDIP CDIP CDIP SOIC SOIC TSSOP TSSOP TSSOP N 14 25 RoHS & Green N 14 25 RoHS & Green J 14 1 Non-RoHS & Green J 14 1 Non-RoHS & Green D 14 50 RoHS & Green D 14 2500 RoHS & Green PW 14 90 RoHS & Green PW 14 2000 RoHS & Green PW 14 2000 RoHS & Green Lead finish/ Ball material (6) NIPDAU NIPDAU SNPB SNPB NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU MSL Peak Temp Op Temp (°C) (3) N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type -55 to 125 -55 to 125 -55 to 125 N / A for Pkg Type -55 to 125 Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 Device Marking (4/5) CD4001UBE CD4001UBE CD4001UBF CD4001UBF3A CD4001UBM CD4001UB...