CD40174BE

Data sheet acquired from Harris Semiconductor SCHS104C − Revised October 2003 The CD40174B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) CD40174BE CD40174BEE4 CD40174BF CD40174BF3A CD40174BM CD40174BM96 CD40174BNSR CD40174BPW ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE PDIP PDIP CDIP CDIP SOIC SOIC SO TSSOP N 16 25 RoHS & Green N 16 25 RoHS & Green J 16 1 Non-RoHS & Green J 16 1 Non-RoHS & Green D 16 40 RoHS & Green D 16 2500 RoHS & Green NS 16 2000 RoHS & Green PW 16 90 RoHS & Green Lead finish/ Ball material (6) NIPDAU NIPDAU SNPB SNPB NIPDAU NIPDAU NIPDAU NIPDAU MSL Peak Temp Op Temp (°C) (3) N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type -55 to 125 -55 to 125 -55 to 125 N / A for Pkg Type -55 to 125 Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM -55 to 125 -55 to 125 -55 to 125 -55 to 125 Device Marking (4/5) CD40174BE CD40174BE CD40174BF CD40174BF3A CD40174BM CD40174BM CD40174B CM0174B (1) The marketing status values are defined as follows: ACTIVE: Product de...