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CD40174BM Dataheets PDF



Part Number CD40174BM
Manufacturers Texas Instruments
Logo Texas Instruments
Description CMOS HEX D-TYPE FLIP-FLOP
Datasheet CD40174BM DatasheetCD40174BM Datasheet (PDF)

Data sheet acquired from Harris Semiconductor SCHS104C − Revised October 2003 The CD40174B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Sta.

  CD40174BM   CD40174BM


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Data sheet acquired from Harris Semiconductor SCHS104C − Revised October 2003 The CD40174B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) CD40174BE CD40174BEE4 CD40174BF CD40174BF3A CD40174BM CD40174BM96 CD40174BNSR CD40174BPW ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE PDIP PDIP CDIP CDIP SOIC SOIC SO TSSOP N 16 25 RoHS & Green N 16 25 RoHS & Green J 16 1 Non-RoHS & Green J 16 1 Non-RoHS & Green D 16 40 RoHS & Green D 16 2500 RoHS & Green NS 16 2000 RoHS & Green PW 16 90 RoHS & Green Lead finish/ Ball material (6) NIPDAU NIPDAU SNPB SNPB NIPDAU NIPDAU NIPDAU NIPDAU MSL Peak Temp Op Temp (°C) (3) N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type -55 to 125 -55 to 125 -55 to 125 N / A for Pkg Type -55 to 125 Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM -55 to 125 -55 to 125 -55 to 125 -55 to 125 Device Marking (4/5) CD40174BE CD40174BE CD40174BF CD40174BF3A CD40174BM CD40174BM CD40174B CM0174B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD40174B, CD40174B-MIL : • Catalog: CD40174B • Military: CD40174B-MIL NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 2 www.ti.com TAPE AND REEL INFORMATION PACKAGE MATERIALS INFORMATION 17-Dec-2020 *All dimensions are nominal.


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