CD40175B

Data sheet acquired from Harris Semiconductor SCHS105C − Revised October 2003 The CD40175B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) CD40175BE CD40175BEE4 CD40175BF3A CD40175BM CD40175BM96 CD40175BMT CD40175BNSR CD40175BPWR ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE PDIP PDIP CDIP SOIC SOIC SOIC SO TSSOP N 16 25 RoHS & Green N 16 25 RoHS & Green J 16 1 Non-RoHS & Green D 16 40 RoHS & Green D 16 2500 RoHS & Green D 16 250 RoHS & Green NS 16 2000 RoHS & Green PW 16 2000 RoHS & Green Lead finish/ Ball material (6) NIPDAU NIPDAU SNPB NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU MSL Peak Temp Op Temp (°C) (3) N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type -55 to 125 -55 to 125 -55 to 125 Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 Device Marking (4/5) CD40175BE CD40175BE CD40175BF3A CD40175BM CD40175BM CD40175BM CD40175B CM0175B (1) The marketing status values are defined as follows: ACTIVE: Product devi...