CD4018BF

Data sheet acquired from Harris Semiconductor SCHS028C − Revised October 2003 The CD4018B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright © 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device CD4018BE Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) ACTIVE PDIP N 16 25 RoHS & Green Lead finish/ Ball material (6) NIPDAU MSL Peak Temp Op Temp (°C) (3) N / A for Pkg Type -55 to 125 CD4018BF CD4018BF3A CD4018BM ACTIVE ACTIVE ACTIVE CDIP CDIP SOIC J 16 1 Non-RoHS & Green J 16 1 Non-RoHS & Green D 16 40 RoHS & Green SNPB SNPB NIPDAU N / A for Pkg Type -55 to 125 N / A for Pkg Type -55 to 125 Level-1-260C-UNLIM -55 to 125 CD4018BM96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4018BMT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4018BNSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4018BPW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4018BPWE4 ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 JM38510/05652BEA M38510/05652BEA ACTIVE ACTIVE CDIP CDIP J 16 1 Non-Ro...