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MicroProcessor. OSD3358-512M-ISM Datasheet

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MicroProcessor. OSD3358-512M-ISM Datasheet






OSD3358-512M-ISM MicroProcessor. Datasheet pdf. Equivalent




OSD3358-512M-ISM MicroProcessor. Datasheet pdf. Equivalent





Part

OSD3358-512M-ISM

Description

MicroProcessor



Feature


Introduction The OSD335x-SM Family of Sy stem-InPackage (SiP) products are build ing blocks designed to allow easy and c ost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. T he OSD335x-SM integrates the AM335x alo ng with the TI TPS65217C PMIC, the TI T L5209 LDO, up to 1 Gigabyte (GB) of DDR 3 Memory, a 4 Kilobyte.
Manufacture

OCTAVO

Datasheet
Download OSD3358-512M-ISM Datasheet


OCTAVO OSD3358-512M-ISM

OSD3358-512M-ISM; (KB) EEPROM for non-volatile configurat ion storage and resistors, capacitors, and inductors into a single 21mm x 21mm design-in-ready package. With this lev el of integration, the OSD335xSM Family of SiPs allows designers to focus on t he key aspects of their system without spending time on the complicated highsp eed design of the processor/DDR3 interf ace or the PMIC po.


OCTAVO OSD3358-512M-ISM

wer distribution. It also reduces the ov erall size and complexity of the design and the supply chain. The OSD335x-SM c an significantly decrease the time to m arket for AM335x-based products. Featur es • TI AM335x, TPS65217C, TL5209, DD R3, EEPROM and passive components integ rated into a single package • TI AM33 5x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit .


OCTAVO OSD3358-512M-ISM

SAR ADC o Ethernet 10/100/1000 x 2 o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO x3 o LCD Controller o SGX 3D Graphics Engine o PRU Subsystem • Access to al l AM335x Peripherals: CAN, SPI, UART, I 2C, GPIO, etc. • Up to 1GB DDR3 OSD3 35x-SM Family Rev. 9 1/1/2021 OSD335x-S M Block Diagram • PWR In: AC Adapter, USB or Single cell (1S) Li-Ion / Li-Po Battery • PWR Out: 1.8V.

Part

OSD3358-512M-ISM

Description

MicroProcessor



Feature


Introduction The OSD335x-SM Family of Sy stem-InPackage (SiP) products are build ing blocks designed to allow easy and c ost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. T he OSD335x-SM integrates the AM335x alo ng with the TI TPS65217C PMIC, the TI T L5209 LDO, up to 1 Gigabyte (GB) of DDR 3 Memory, a 4 Kilobyte.
Manufacture

OCTAVO

Datasheet
Download OSD3358-512M-ISM Datasheet




 OSD3358-512M-ISM
Introduction
The OSD335x-SM Family of System-In-
Package (SiP) products are building blocks
designed to allow easy and cost-effective
implementation of systems based on Texas
Instruments’ powerful Sitara™ AM335x line
of processors. The OSD335x-SM
integrates the AM335x along with the TI
TPS65217C PMIC, the TI TL5209 LDO, up
to 1 Gigabyte (GB) of DDR3 Memory, a 4
Kilobyte (KB) EEPROM for non-volatile
configuration storage and resistors,
capacitors, and inductors into a single
21mm x 21mm design-in-ready package.
With this level of integration, the OSD335x-
SM Family of SiPs allows designers to focus
on the key aspects of their system without
spending time on the complicated high-
speed design of the processor/DDR3
interface or the PMIC power distribution. It
also reduces the overall size and complexity
of the design and the supply chain. The
OSD335x-SM can significantly decrease the
time to market for AM335x-based products.
Features
TI AM335x, TPS65217C, TL5209,
DDR3, EEPROM and passive
components integrated into a single
package
TI AM335x Features:
o ARM® Cortex®-A8 up to 1GHz
o 8 channel 12-bit SAR ADC
o Ethernet 10/100/1000 x 2
o USB 2.0 HS OTG + PHY x2
o MMC, SD and SDIO x3
o LCD Controller
o SGX 3D Graphics Engine
o PRU Subsystem
Access to all AM335x Peripherals:
CAN, SPI, UART, I2C, GPIO, etc.
Up to 1GB DDR3
OSD335x-SM Family
Rev. 9 1/1/2021
OSD335x-SM Block Diagram
PWR In: AC Adapter, USB or Single
cell (1S) Li-Ion / Li-Po Battery
PWR Out: 1.8V, 3.3V and SYS
Selectable AM335x I/O Voltage:
1.8V or 3.3V
Benefits
Integrates over 100 components into
one package
Compatible with AM335x
development tools and software
Wide BGA ball pitch allows for low-
cost assembly.
Significantly reduces design time
Decreases layout complexity
60% reduction in board space vs
discrete implementation
Increased reliability through reduced
number of components
Package
256 Ball BGA (21mm X 21mm)
16 X 16 grid, 1.27mm pitch
Temp Range: 0 to 85°C, -40 to 85°C
Octavo Systems LLC
Copyright 2017-2021




 OSD3358-512M-ISM
2
OSD335x-SM Family
Rev. 9 1/1/2021
Table of Contents
1 Revision History ....................................................................................... 4
2 Block Diagram ......................................................................................... 5
2.1 Passives ........................................................................................... 6
2.1.1 Additional Required Bulk Capacitance .................................................. 6
2.1.2 Integrated Bulk Capacitance ............................................................. 6
2.1.3 Integrated Resistors........................................................................ 7
3 Product Number Information ........................................................................ 8
4 Reference Documents ............................................................................... 10
4.1 Data Sheets ...................................................................................... 10
4.2 Other References ............................................................................... 10
5 Ball Map ............................................................................................... 11
5.1 Ball Description ................................................................................. 16
5.2 Not Connected Balls ............................................................................ 19
5.3 Reserved Signals ................................................................................ 19
6 OSD335x-SM Components ........................................................................... 21
6.1 AM335x Processor............................................................................... 21
6.1.1 I/O Voltages................................................................................ 21
6.2 DDR3 Memory.................................................................................... 21
6.3 EEPROM .......................................................................................... 23
6.3.1 EEPROM Contents ......................................................................... 23
6.3.2 EEPROM Write Protection ................................................................ 23
7 Power Management .................................................................................. 24
7.1 Input Power...................................................................................... 24
7.1.1 VIN_AC ...................................................................................... 24
7.1.2 VIN_USB..................................................................................... 24
7.1.3 VIN_BAT..................................................................................... 24
7.2 Output Power ................................................................................... 24
7.2.1 SYS_VOUT: Switched VIN_AC, VIN_USB, or VIN_BAT ................................. 24
7.2.2 SYS_VDD1_3P3V............................................................................ 25
7.2.3 SYS_VDD2_3P3V............................................................................ 25
7.2.4 SYS_VDD3_3P3V............................................................................ 25
Octavo Systems LLC
Copyright 2017-2021




 OSD3358-512M-ISM
3
OSD335x-SM Family
Rev. 9 1/1/2021
7.2.5 SYS_RTC_1P8V ............................................................................. 25
7.2.6 SYS_VDD_1P8V ............................................................................. 25
7.2.7 SYS_ADC_1P8V ............................................................................. 25
7.3 Internal Power .................................................................................. 25
7.3.1 VDDS_DDR .................................................................................. 25
7.3.2 VDD_MPU ................................................................................... 26
7.3.3 VDD_CORE .................................................................................. 26
7.3.4 VDDS_PLL ................................................................................... 26
7.4 Total Current Consideration .................................................................. 26
7.5 Control and Status .............................................................................. 27
7.5.1 Minimum IO voltage domain connections .............................................. 27
7.5.2 Minimum Processor-PMIC interface Connections ..................................... 27
7.5.3 Minimum RTC Power Connections....................................................... 29
8 Electrical & Thermal Characteristics.............................................................. 30
9 Packaging Information............................................................................... 31
9.1 Mechanical Dimensions ........................................................................ 31
9.1.1 Landing Pad Sizing ........................................................................ 31
9.2 Reflow Instructions ............................................................................. 32
9.3 Storage Requirements.......................................................................... 32
Octavo Systems LLC
Copyright 2017-2019






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