DatasheetsPDF.com

HD74LS32P Dataheets PDF



Part Number HD74LS32P
Manufacturers Renesas
Logo Renesas
Description Quadruple 2-input Positive OR Gate
Datasheet HD74LS32P DatasheetHD74LS32P Datasheet (PDF)

HD74LS32 Quadruple 2-input Positive OR Gate Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation HD74LS32P DILP-14 pin PRDP0014AB-B (DP-14AV) P HD74LS32FPEL SOP-14 pin (JEITA) PRSP0014DF-B FP (FP-14DAV) Note: Please consult the sales office for the above package availability. Pin Arrangement REJ03D0405–0200 Rev.2.00 Feb.18.2005 Taping Abbreviation (Quantity) — EL (2,000 pcs/reel) 1A 1 1B 2 1Y 3 2A 4 2B 5 2Y 6 GND 7 14 VCC 13 .

  HD74LS32P   HD74LS32P


Document
HD74LS32 Quadruple 2-input Positive OR Gate Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation HD74LS32P DILP-14 pin PRDP0014AB-B (DP-14AV) P HD74LS32FPEL SOP-14 pin (JEITA) PRSP0014DF-B FP (FP-14DAV) Note: Please consult the sales office for the above package availability. Pin Arrangement REJ03D0405–0200 Rev.2.00 Feb.18.2005 Taping Abbreviation (Quantity) — EL (2,000 pcs/reel) 1A 1 1B 2 1Y 3 2A 4 2B 5 2Y 6 GND 7 14 VCC 13 4B 12 4A 11 4Y 10 3B 9 3A 8 3Y (Top view) Rev.2.00, Feb.18.2005, page 1 of 4 HD74LS32 Circuit Schematic (1/4) Inputs A B 20k 20k 11k 8k VCC 75 4.5k 1.5k 3k Output Y GND Absolute Maximum Ratings Item Symbol Ratings Supply voltage VCC 7 Input voltage VIN 7 Power dissipation PT 400 Storage temperature Tstg –65 to +150 Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Symbol VCC IOH IOL Topr Min 4.75 — — –20 Typ 5.00 — — 25 Max 5.25 –400 8 75 Unit V V mW °C Unit V µA mA °C Rev.2.00, Feb.18.2005, page 2 of 4 HD74LS32 Electrical Characteristics Item Input voltage Output voltage Symbol VIH VIL VOH VOL IIH Input current IIL II Short-circuit output current IOS Supply current ICCH ICCL Input clamp voltage VIK Note: * VCC = 5 V, Ta = 25°C min. 2.0 — 2.7 — — — — — –20 — — — typ.* — — — — — — — — — 3.1 4.9 — max. — 0.8 — 0.5 0.4 20 –0.4 0.1 –100 6.2 9.8 –1.5 Unit V V V V µA mA mA mA mA mA V (Ta = –20 to +75 °C) Condition VCC = 4.75 V, VIH = 2 V, IOH = –400 µA IOL = 8 mA IOL = 4 mA VCC = 4.75 V, VIL = 0.8 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VCC = 5.25 V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Symbol min. typ. max. Unit Condition Propagation delay time tPLH — tPHL — 14 14 22 22 ns ns CL = 15 pF, RL = 2 kΩ Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D0005- 0100)". Rev.2.00, Feb.18.2005, page 3 of 4 HD74LS32 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B D 14 Previous Code DP-14AV 8 MASS[Typ.] 0.97g E 1 Z 7 b3 e bp JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B Previous Code FP-14DAV *1 D 14 8 HE *2 E Index mark 1 Z e 7 *3 b p xM A y A1 L A θ MASS[Typ.] 0.23g F c e1 ( Ni/Pd/Au plating ) Reference Symbol e1 D E A A1 bp b3 c θ e Z L Dimension in Millimeters Min Nom Max 7.62 19.2 20.32 6.3 7.4 5.06 0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0° 15° 2.29 2.54 2.79 2.39 2.54 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. A1 c bp Terminal cross section ( Ni/Pd/Au plating ) L1 θ L Detail F Reference Symbol D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 10.06 10.5 5.50 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 7.50 7.80 8.00 1.27 0.12 0.15 1.42 0.50 0.70 0.90 1.15 Rev.2.00, Feb.18.2005, page 4 of 4 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp..


HD74LS30P HD74LS32P HD74LS367AP


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)