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NIS6351 Dataheets PDF



Part Number NIS6351
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description +5 Volt Electronic eFuse
Datasheet NIS6351 DatasheetNIS6351 Datasheet (PDF)

+5 Volt Electronic eFuse NIS6351 The NIS6351 is a cost effective, resettable fuse which can greatly enhance the reliability of a USB application from both catastrophic and shutdown failures. It is designed to buffer the load device from excessive input voltage which can damage sensitive circuits and to protect the input side circuitry from reverse currents. It includes an overvoltage clamp circuit that limits the output voltage during transients but does not shut the unit down, thereby allowing.

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+5 Volt Electronic eFuse NIS6351 The NIS6351 is a cost effective, resettable fuse which can greatly enhance the reliability of a USB application from both catastrophic and shutdown failures. It is designed to buffer the load device from excessive input voltage which can damage sensitive circuits and to protect the input side circuitry from reverse currents. It includes an overvoltage clamp circuit that limits the output voltage during transients but does not shut the unit down, thereby allowing the load circuit to continue its operation. Features • 85 mW Max RDS(on) • Integrated Reverse Current Protection • Adjustable Output Current Limit Protection with Thermal Shutdown • IEC61000−4−2 Level 4 ESD Protection for Vbus up to ±7 kV • Fast Response Overvoltage Clamp Circuit with Selectable Level • Internal Undervoltage Lockout Circuit • Digital Enable with Separate FLAG for Fault Identification • Integrated Current Monitoring • Both Latching and Auto−Retry Options Available • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • Automotive Infotainment • USB 2.0/3.0/3.1 VBUS • USB Type−C PD Charging • Solid State Drives • Mother Boards www.onsemi.com WDFNW10, 3 x 3 CASE 515AB MARKING DIAGRAM XXXXX XXXXX ALYWG G A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS VCC VCC GND IMON Vc_SEL 1 N/C (Top View) SRC SRC Ilim EN FLAG ORDERING INFORMATION See detailed ordering, marking and shipping information on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2020 1 August, 2020 − Rev. 1 Publication Order Number: NIS6351/D D− D+ USB 2.0 Connector Vbus GND EN FLAG NIS6351 NIV1161/NIV2161 D− Vcc USB Transceiver IC D+ GND +3.3V System Power CL 22μF 1 μF RMON 1kΩ Floating or Grounded Vcc Vcc GND Imon Source Source NIS6351 Ilim EN Vc_SEL FLAG 47μF CIN Rlim Enable FLAG Figure 1. Typical USB 2.0 Application Circuit VCC EN FLAG Reverse Current +5V System Power Vc_SEL Thermal Shutdown UVLO Voltage Clamp Charge Pump Current Sense Current Limit Source Imon Ilim Figure 2. Block Diagram GND PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1, 2 VCC Positive input voltage to the device. (Low ESR capacitor of minimum 47 mF from VCC to GND is required) 3 GND Negative input voltage to the device. This is used as the internal reference for the IC. 4 IMON This pin can be used to monitor the output current by using an external pull−down resistor and de−coupling capacitor. 5 Vc_SEL The Vc_SEL pin allows the overvoltage clamp to be set at either a 5.6 V or 6.2 V minimum. 6 FLAG If a thermal fault occurs, the voltage on this pin will go to a low state to signal a monitoring circuit that the device is in thermal shutdown. 7 EN When this pin is pulled low the eFuse is turned off. It can be used to enable or disable the output of the device by pulling it to ground using an open drain or open collector device, as it has an internal pull−up. 8 Ilim A resistor between this pin and the source pin sets the overload and short circuit current limit levels. 9, 10 Source Source of the internal power FET and the output terminal of the fuse 11 N/C (EP) (Exposed Pad) This pad to be used as heatsink only with no electrical connection. It should be connected to a large area of copper on the PCB, or to the PCB’s GND plane. www.onsemi.com 2 NIS6351 MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage, operating, steady−state (VCC to GND) Transient (100 ms) VCC −0.3 to +10 V −0.3 to +10 Output Voltage, operating, steady−state (SRC to GND) Voltage range on ILIM pin Voltage range on Enable pin Voltage range on FLAG pin Voltage range on all other pins VOUT −0.3 to +20 V VILIM −0.3 to +20 V VEN −0.3 to 5 V VFLAG −0.3 to 6 V −0.3 to 5 V Electrostatic Discharge Human Body Model (All pins) Charged Device Model (All pins) IEC61000−4−2 Contact (Source pins, with 22 mF CSOURCE condition) ESD kV ±2 ±1 ±7 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RATINGS Rating Thermal Resistance, Junction−to−Air (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu) Thermal Characterization Parameter, Junction−to−Lead (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu) Thermal Characterization Parameter, Junction−to−Board (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu) Thermal Characterization Parameter, Junction−to−Top (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu) Total Continuous Power Dissipation @ TA = 25°C (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu) Derate above 25°C Operating .


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