Document
+5 Volt Electronic eFuse
NIS6351
The NIS6351 is a cost effective, resettable fuse which can greatly enhance the reliability of a USB application from both catastrophic and shutdown failures.
It is designed to buffer the load device from excessive input voltage which can damage sensitive circuits and to protect the input side circuitry from reverse currents. It includes an overvoltage clamp circuit that limits the output voltage during transients but does not shut the unit down, thereby allowing the load circuit to continue its operation.
Features
• 85 mW Max RDS(on) • Integrated Reverse Current Protection • Adjustable Output Current Limit Protection with Thermal Shutdown • IEC61000−4−2 Level 4 ESD Protection for Vbus up to ±7 kV • Fast Response Overvoltage Clamp Circuit with Selectable Level • Internal Undervoltage Lockout Circuit • Digital Enable with Separate FLAG for Fault Identification • Integrated Current Monitoring • Both Latching and Auto−Retry Options Available • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Automotive Infotainment • USB 2.0/3.0/3.1 VBUS • USB Type−C PD Charging • Solid State Drives • Mother Boards
www.onsemi.com
WDFNW10, 3 x 3 CASE 515AB
MARKING DIAGRAM
XXXXX XXXXX ALYWG
G
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
VCC VCC GND IMON Vc_SEL
1 N/C
(Top View)
SRC SRC Ilim EN FLAG
ORDERING INFORMATION
See detailed ordering, marking and shipping information on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2020
1
August, 2020 − Rev. 1
Publication Order Number: NIS6351/D
D− D+
USB 2.0 Connector
Vbus GND
EN FLAG
NIS6351
NIV1161/NIV2161
D− Vcc
USB Transceiver
IC
D+ GND
+3.3V System Power
CL
22μF
1 μF
RMON 1kΩ
Floating or Grounded
Vcc Vcc GND Imon
Source Source
NIS6351
Ilim
EN
Vc_SEL
FLAG
47μF
CIN
Rlim Enable FLAG
Figure 1. Typical USB 2.0 Application Circuit VCC
EN FLAG
Reverse Current
+5V System Power
Vc_SEL
Thermal Shutdown
UVLO
Voltage Clamp
Charge Pump
Current Sense
Current Limit
Source
Imon
Ilim
Figure 2. Block Diagram
GND
PIN FUNCTION DESCRIPTION Pin No. Pin Name
Description
1, 2
VCC
Positive input voltage to the device. (Low ESR capacitor of minimum 47 mF from VCC to GND is required)
3
GND
Negative input voltage to the device. This is used as the internal reference for the IC.
4
IMON
This pin can be used to monitor the output current by using an external pull−down resistor and de−coupling
capacitor.
5
Vc_SEL The Vc_SEL pin allows the overvoltage clamp to be set at either a 5.6 V or 6.2 V minimum.
6
FLAG
If a thermal fault occurs, the voltage on this pin will go to a low state to signal a monitoring circuit that the
device is in thermal shutdown.
7
EN
When this pin is pulled low the eFuse is turned off. It can be used to enable or disable the output of the
device by pulling it to ground using an open drain or open collector device, as it has an internal pull−up.
8
Ilim
A resistor between this pin and the source pin sets the overload and short circuit current limit levels.
9, 10
Source
Source of the internal power FET and the output terminal of the fuse
11
N/C (EP) (Exposed Pad) This pad to be used as heatsink only with no electrical connection. It should be connected
to a large area of copper on the PCB, or to the PCB’s GND plane.
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NIS6351
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage, operating, steady−state (VCC to GND) Transient (100 ms)
VCC
−0.3 to +10
V
−0.3 to +10
Output Voltage, operating, steady−state (SRC to GND) Voltage range on ILIM pin Voltage range on Enable pin Voltage range on FLAG pin Voltage range on all other pins
VOUT
−0.3 to +20
V
VILIM
−0.3 to +20
V
VEN
−0.3 to 5
V
VFLAG
−0.3 to 6
V
−0.3 to 5
V
Electrostatic Discharge Human Body Model (All pins) Charged Device Model (All pins) IEC61000−4−2 Contact (Source pins, with 22 mF CSOURCE condition)
ESD
kV ±2 ±1 ±7
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
THERMAL RATINGS
Rating
Thermal Resistance, Junction−to−Air (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu)
Thermal Characterization Parameter, Junction−to−Lead (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu)
Thermal Characterization Parameter, Junction−to−Board (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu)
Thermal Characterization Parameter, Junction−to−Top (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu)
Total Continuous Power Dissipation @ TA = 25°C (4 layer High−K JEDEC JESD51−7 PCB, 100 mm2, 2 oz. Cu)
Derate above 25°C
Operating .