THJP1225

www.vishay.com THJP Vishay Dale Thin Film ThermaWickTM Thermal Jumper Surface Mount Chip LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Infographics THJP surface mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride substrates in both SnPb and Pb-free wraparound termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available. CONSTRUCTION Solder coating Nickel termination Aluminum nitride substrate FEATURES Electrically isolated thermal conductor High thermal conductivity AlN substrate (170 W/mK) Electrically isolated terminations (> 999 MΩ) Available Available Low capacitance Available with SnPb or lead (Pb)-free wrap terminations Available Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS Power supplies and converters RF amplifiers Synthesizers Switch mode power supplies Pin and laser diodes Filters FUNCTIONAL APPLICATIONS / CONNECTION OPTIONS Component to heat sink Component to case Component to ground plane Pad to pad Pad to via Pad to trace HEAT TRANSFER DEMONSTRATION Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices were mounted to ...