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flat package. LQFP100 Datasheet

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flat package. LQFP100 Datasheet
















LQFP100 package. Datasheet pdf. Equivalent













Part

LQFP100

Description

plastic low profile quad flat package



Feature


LQFP100 SOT407-1 LQFP100, plastic low profile quad flat package; 100 leads; 0 .5 mm pitch, 14 mm x 14 mm x 1.4 mm bo dy 1 February 2019 Package informatio n 1 Package summary Terminal position code Package type descriptive code Pack age type industry code Package style de scriptive code Package body material ty pe IEC package outline code JEDEC packa ge outline code Mo.
Manufacture

NXP

Datasheet
Download LQFP100 Datasheet


NXP LQFP100

LQFP100; unting method type Issue date Manufactur er package code Q (quad) LQFP100 LQFP1 00 LQFP (low profile quad flat package) P (plastic) 136E20 MS-026 S (surface m ount) 20-02-2003 98ASA01402D Table 1.â €‡Package summary Parameter package len gth package width seated height package height nominal pitch actual quantity o f termination Min Nom Max Unit 13. 9 14 14.1 mm 13..


NXP LQFP100

9 14 14.1 mm - 1.6 - mm 1.35 1. 4 1.45 mm - 0.5 - mm - 100 - NXP Semiconductors SOT407-1 LQFP100, plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body 2 Package outline LQFP10 0: plastic low profile quad flat packag e; 100 leads; body 14 x 14 x 1.4 mm SO T407-1 y 75 76 X 51 50 ZE c A 100 1 pin 1 index e .


NXP LQFP100

wM bp D HD e E HE wM bp 26 25 ZD v M A B vM B A A2 A1 detail X (A3) Î ¸ Lp L 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HD HE L mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 14.1 13.9 0.5 16.25 16.25 15.75 15. 75 1 Lp v w y ZD (1) ZE (1) θ 0.7 5 0.45 0.2 0.08 0.





Part

LQFP100

Description

plastic low profile quad flat package



Feature


LQFP100 SOT407-1 LQFP100, plastic low profile quad flat package; 100 leads; 0 .5 mm pitch, 14 mm x 14 mm x 1.4 mm bo dy 1 February 2019 Package informatio n 1 Package summary Terminal position code Package type descriptive code Pack age type industry code Package style de scriptive code Package body material ty pe IEC package outline code JEDEC packa ge outline code Mo.
Manufacture

NXP

Datasheet
Download LQFP100 Datasheet




 LQFP100
SOT407-1
LQFP100, plastic low profile quad flat package; 100 leads; 0.5
mm pitch, 14 mm x 14 mm x 1.4 mm body
1 February 2019
Package information
1 Package summary
Terminal position code
Package type descriptive code
Package type industry code
Package style descriptive code
Package body material type
IEC package outline code
JEDEC package outline code
Mounting method type
Issue date
Manufacturer package code
Q (quad)
LQFP100
LQFP100
LQFP (low profile quad flat package)
P (plastic)
136E20
MS-026
S (surface mount)
20-02-2003
98ASA01402D
Table 1. Package summary
Parameter
package length
package width
seated height
package height
nominal pitch
actual quantity of termination
Min
Nom
Max
Unit
13.9
14
14.1
mm
13.9
14
14.1
mm
-
1.6
-
mm
1.35
1.4
1.45
mm
-
0.5
-
mm
-
100
-




 LQFP100
NXP Semiconductors
SOT407-1
LQFP100, plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body
2 Package outline
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
y
75
76
X
51
50
ZE
c
A
100
1
pin 1 index
e
wM
bp
D
HD
e
E HE
wM
bp
26
25
ZD
vM A
B
vM B
A
A2
A1
detail X
(A3)
θ
Lp
L
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c D(1) E(1) e
HD HE L
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
14.1
13.9
0.5
16.25 16.25
15.75 15.75
1
Lp v
w
y ZD (1) ZE (1) θ
0.75
0.45
0.2
0.08
0.08
1.15
0.85
1.15
0.85
7o
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT407-1
IEC
136E20
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
00-02-01
03-02-20
Figure 1. Package outline LQFP100 (SOT407-1)
SOT407-1
Package information
All information provided in this document is subject to legal disclaimers.
1 February 2019
© NXP B.V. 2019. All rights reserved.
2/5




 LQFP100
NXP Semiconductors
SOT407-1
LQFP100, plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body
3 Soldering
Footprint information for reflow soldering of LQFP100 package
SOT407-1
Hx
Gx
P2
P1
(0.125)
Hy Gy
By Ay
C
solder land
occupied area
D2 (8Ă—)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
DIMENSIONS in mm
P1
P2
Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 17.300 17.300 14.300 14.300 1.500 0.280 0.400 14.500 14.500 17.550 17.550
Figure 2. Reflow soldering footprint for LQFP100 (SOT407-1)
SOT407-1
Package information
All information provided in this document is subject to legal disclaimers.
1 February 2019
sot407-1
© NXP B.V. 2019. All rights reserved.
3/5




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