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Plastic Packages. LQFP64 Datasheet

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Plastic Packages. LQFP64 Datasheet
















LQFP64 Packages. Datasheet pdf. Equivalent













Part

LQFP64

Description

Plastic Packages



Feature


Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Packages (L QFP) D D1 -D- -A- -B- E E1 PIN 1 -H - GAGE PLANE 0.020 0.008 MIN 0o MIN L 0.25 0o-7o 0.010 e SEATING A PLANE 0.08 0.003 -C- 11o-13o 0.07 0.003 M C A-B S DS b b1 0.09/0.16 A2 A1 0 .004/0.006 11o-13o BASE METAL WITH PL ATING 0.09/0.20 0.004/0.008 Q64.7x7 (J EDEC MS-026BBD ISS.
Manufacture

Renesas

Datasheet
Download LQFP64 Datasheet


Renesas LQFP64

LQFP64; UE C) 64 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE INCHES MILLIMETERS SYMBOL MI N MAX MIN MAX NOTES A - 0.062 - 1.60 - A1 0.002 0.005 0.05 0.15 - A2 0.054 0.057 1.35 1.45 - b 0.0 05 0.009 0.13 0.23 6 b1 0.005 0.007 0.13 0.19 - D 0.350 0.358 8.90 9. 10 3 D1 0.272 0.280 6.90 7.10 4, 5 E 0.350 0.358 8.90 9.10 3 E1 0.2 72 0.280 6.90 7.1.


Renesas LQFP64

0 4, 5 L 0.018 0.029 0.45 0.75 - N 64 64 7 e 0.0157 BSC 0.40 BSC - NOTES: Rev. 2 7/11 1. Controlling d imension: MILLIMETER. Converted inch di mensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane -C- . 4 . Dimensions D1 and E1 to be determined at datum plane -H.


Renesas LQFP64

- . 5. Dimensions D1 and E1 do not incl ude mold protrusion. Allowable protrusi on is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar pr otrusion. Allowable dambar protrusion s hall not cause the lead width to exceed the maximum b dimension by more than 0 .08mm (0.003 inch). 7. ā€œNā€ is the number of terminal positions. .





Part

LQFP64

Description

Plastic Packages



Feature


Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Packages (L QFP) D D1 -D- -A- -B- E E1 PIN 1 -H - GAGE PLANE 0.020 0.008 MIN 0o MIN L 0.25 0o-7o 0.010 e SEATING A PLANE 0.08 0.003 -C- 11o-13o 0.07 0.003 M C A-B S DS b b1 0.09/0.16 A2 A1 0 .004/0.006 11o-13o BASE METAL WITH PL ATING 0.09/0.20 0.004/0.008 Q64.7x7 (J EDEC MS-026BBD ISS.
Manufacture

Renesas

Datasheet
Download LQFP64 Datasheet




 LQFP64
Plastic Packages for Integrated Circuits
Low Plastic Quad Flatpack Packages (LQFP)
D
D1
-D-
-A-
-B-
E E1
PIN 1
-H-
GAGE
PLANE
0.020
0.008 MIN
0o MIN
L
0.25
0o-7o 0.010
e
SEATING
A PLANE
0.08
0.003
-C-
11o-13o
0.07
0.003
M
C
A-B S
DS
b
b1
0.09/0.16
A2 A1 0.004/0.006
11o-13o
BASE METAL
WITH PLATING
0.09/0.20
0.004/0.008
Q64.7x7 (JEDEC MS-026BBD ISSUE C)
64 LEAD LOW PLASTIC QUAD FLATPACK PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.062
-
1.60
-
A1
0.002 0.005 0.05
0.15
-
A2
0.054 0.057 1.35
1.45
-
b
0.005 0.009 0.13
0.23
6
b1
0.005 0.007 0.13
0.19
-
D
0.350 0.358 8.90
9.10
3
D1
0.272 0.280 6.90
7.10
4, 5
E
0.350 0.358 8.90
9.10
3
E1
0.272 0.280 6.90
7.10
4, 5
L
0.018 0.029 0.45
0.75
-
N
64
64
7
e
0.0157 BSC
0.40 BSC
-
NOTES:
Rev. 2 7/11
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
7. ā€œNā€ is the number of terminal positions.












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