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Pack Package. LQFP64 Datasheet

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Pack Package. LQFP64 Datasheet
















LQFP64 Package. Datasheet pdf. Equivalent













Part

LQFP64

Description

64-Lead Low-Profile Plastic Quad Flat Pack Package



Feature


64-Lead Low-Profile Plastic Quad Flat Pa ck Package (CFA) -10x10 mm Body [LQFP] With 6.2x6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy Note: For the most current package drawings, please see the Microchip Packaging Specificati on located at http://www.microchip.com/ packaging 64X TIPS 0.20 C A-B D D D1 D A E1 4 N B E1 E A A NOTE 1 C SEATING PLANE A .
Manufacture

Microchip

Datasheet
Download LQFP64 Datasheet


Microchip LQFP64

LQFP64; A2 A1 123 D1 4 TOP VIEW SIDE VIEW 4X 0 .20 H A-B D 0.10 C H 64X 0.10 C D2 12 3 N E2 4X 0.20 e BOTTOM VIEW 64x b 0.08 C A-B D Microchip Technology D rawing C04-1080 Rev. A Sheet 1 of 2 © 2019 Microchip Technology Incorporated 64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQF P] With 6.2 mm Exposed Pad and 2.0 mm F oot Print; Micrel L.


Microchip LQFP64

egacy Note: For the most current package drawings, please see the Microchip Pac kaging Specification located at http:// www.microchip.com/packaging α H θ c L (L1) SECTION A-A Number of Leads Lead Pitch Overall Height Units Dimension Limits N e A MILLIMETERS MIN NOM MA X 64 0.50 BSC - - 1.60 Notes: St andoff Molded Package Thickness Foot Le ngth Footprint Foot .


Microchip LQFP64

Angle Overall Width Overall Length Molde d Package Width Molded Package Length E xposed Pad Width Exposed Pad Length Lea d Width Lead Thickness Mold Draft Angle Top A1 0.05 0.10 0.15 A2 1.35 1 .40 1.45 L 0.45 0.60 0.75 L1 1.0 0 REF θ 0° 3.5° 7° E 12.00 BS C D 12.00 BSC E1 10.00 BSC D1 10. 00 BSC E2 6.10 6.20 6.30 D2 6.10 6.20 6.30 b 0.17 .





Part

LQFP64

Description

64-Lead Low-Profile Plastic Quad Flat Pack Package



Feature


64-Lead Low-Profile Plastic Quad Flat Pa ck Package (CFA) -10x10 mm Body [LQFP] With 6.2x6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy Note: For the most current package drawings, please see the Microchip Packaging Specificati on located at http://www.microchip.com/ packaging 64X TIPS 0.20 C A-B D D D1 D A E1 4 N B E1 E A A NOTE 1 C SEATING PLANE A .
Manufacture

Microchip

Datasheet
Download LQFP64 Datasheet




 LQFP64
64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP]
With 6.2x6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
64X TIPS
0.20 C A-B D
D
D1
D
A
E1
4
N
B
E1 E
A
A
NOTE 1
C
SEATING
PLANE
A A2
A1
123
D1
4
TOP VIEW
SIDE VIEW
4X
0.20 H A-B D
0.10 C
H
64X
0.10 C
D2
12 3
N
E2
4X
0.20
e
BOTTOM VIEW
64x b
0.08 C A-B D
Microchip Technology Drawing C04-1080 Rev. A Sheet 1 of 2
© 2019 Microchip Technology Incorporated




 LQFP64
64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP]
With 6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
α
H
θ
c
L
(L1)
SECTION A-A
Number of Leads
Lead Pitch
Overall Height
Units
Dimension Limits
N
e
A
MILLIMETERS
MIN
NOM
MAX
64
0.50 BSC
-
-
1.60
Notes:
Standoff
Molded Package Thickness
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Exposed Pad Width
Exposed Pad Length
Lead Width
Lead Thickness
Mold Draft Angle Top
A1
0.05
0.10
0.15
A2
1.35
1.40
1.45
L
0.45
0.60
0.75
L1
1.00 REF
θ
3.5°
E
12.00 BSC
D
12.00 BSC
E1
10.00 BSC
D1
10.00 BSC
E2
6.10
6.20
6.30
D2
6.10
6.20
6.30
b
0.17
0.22
0.27
c
0.09
-
0.20
α
11°
12°
13°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1080 Rev. A Sheet 2 of 2
© 2019 Microchip Technology Incorporated




 LQFP64
64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP]
With 6.2x6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
EV
C2 Y2
EV
64
SILK SCREEN
123
E
ØV
G1
Y1
X1
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X64)
X1
Contact Pad Length (X64)
Y1
Contact Pad to Contact Pad (X60) G1
Thermal Via Diameter
V
Thermal Via Pitch
EV
MILLIMETERS
MIN
NOM
MAX
0.50 BSC
6.30
6.30
11.40
11.40
0.30
1.50
0.20
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3080 Rev. A
© 2019 Microchip Technology Incorporated




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