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flat package. SOT414-1 Datasheet

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flat package. SOT414-1 Datasheet
















SOT414-1 package. Datasheet pdf. Equivalent













Part

SOT414-1

Description

plastic low profile quad flat package



Feature


LQFP64 SOT414-1 plastic low profile qu ad flat package; 64 leads; body 7 x 7 x 1.4 mm 8 February 2016 Package info rmation 1. Package summary Terminal p osition code Package type descriptive c ode Package type industry code Package style descriptive code Package style su ffix code Package body material type IE C package outline code JEDEC package ou tline code Mountin.
Manufacture

NXP

Datasheet
Download SOT414-1 Datasheet


NXP SOT414-1

SOT414-1; g method type Issue date Table 1. Packa ge summary Symbol Parameter D packa ge length E package width A seated height A2 package height n2 actual quantity of termination Q (quad) LQFP6 4 LQFP64 LQFP (low profile quad flat pa ckage) NA (not applicable) P (plastic) 136E06 MS-026 S (surface mount) 20-2-20 03 Min Typ Nom Max Unit 6.9 - 7 7.1 mm 6.9 - .


NXP SOT414-1

7 7.1 mm [tbd] - 1.6 1.6 mm 1.3 5 - 1.4 1.45 mm - - 64 - NXP S emiconductors SOT414-1 plastic low pro file quad flat package; 64 leads; body 7 x 7 x 1.4 mm 2. Package outline LQFP 64: plastic low profile quad flat packa ge; 64 leads; body 7 x 7 x 1.4 mm SOT4 14-1 c y X 48 49 64 1 e pin 1 index 33 A 32 ZE e E HE wM bp 17 16 ZD wM bp D B HD .


NXP SOT414-1

vM A vM B A A2 A1 (A3) θ Lp L detail X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A m ax. A1 A2 A3 bp c D(1) E(1) e HD HE L Lp v w y ZD(1) Z E(1) θ mm 1.6 0.15 0.05 1.45 1.35 0.25 0.23 0 .13 0.20 0.09 7.1 6.9 7.1 6.9 0.4 9.15 8.85 9.15 8.85 1 0.75 0.45 0.2 0.08 0.08 0.64 0.36 0.64 0.36 7o 0o Note 1. Plastic .





Part

SOT414-1

Description

plastic low profile quad flat package



Feature


LQFP64 SOT414-1 plastic low profile qu ad flat package; 64 leads; body 7 x 7 x 1.4 mm 8 February 2016 Package info rmation 1. Package summary Terminal p osition code Package type descriptive c ode Package type industry code Package style descriptive code Package style su ffix code Package body material type IE C package outline code JEDEC package ou tline code Mountin.
Manufacture

NXP

Datasheet
Download SOT414-1 Datasheet




 SOT414-1
SOT414-1
plastic low profile quad flat package; 64 leads; body 7 x 7 x
1.4 mm
8 February 2016
Package information
1. Package summary
Terminal position code
Package type descriptive code
Package type industry code
Package style descriptive code
Package style suffix code
Package body material type
IEC package outline code
JEDEC package outline code
Mounting method type
Issue date
Table 1. Package summary
Symbol
Parameter
D
package length
E
package width
A
seated height
A2
package height
n2
actual quantity of termination
Q (quad)
LQFP64
LQFP64
LQFP (low profile quad flat package)
NA (not applicable)
P (plastic)
136E06
MS-026
S (surface mount)
20-2-2003
Min
Typ
Nom
Max
Unit
6.9
-
7
7.1
mm
6.9
-
7
7.1
mm
[tbd]
-
1.6
1.6
mm
1.35
-
1.4
1.45
mm
-
-
64
-




 SOT414-1
NXP Semiconductors
SOT414-1
plastic low profile quad flat package; 64 leads;
body 7 x 7 x 1.4 mm
2. Package outline
LQFP64: plastic low profile quad flat package; 64 leads; body 7 x 7 x 1.4 mm
SOT414-1
c
y
X
48
49
64
1
e
pin 1 index
33
A
32
ZE
e
E HE
wM
bp
17
16
ZD
wM
bp
D
B
HD
vM A
vM B
A A2
A1
(A3)
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c D(1) E(1) e
HD HE L
Lp
v
w
y ZD(1) Z E(1) θ
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.23
0.13
0.20
0.09
7.1
6.9
7.1
6.9
0.4
9.15
8.85
9.15
8.85
1
0.75
0.45
0.2
0.08
0.08
0.64
0.36
0.64
0.36
7o
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT414-1
IEC
136E06
REFERENCES
JEDEC
JEITA
MS-026
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-20
Fig. 1. Package outline LQFP64 (SOT414-1)
SOT414-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved
2/5




 SOT414-1
NXP Semiconductors
3. Soldering
Footprint information for reflow soldering of LQFP64 package
SOT414-1
plastic low profile quad flat package; 64 leads;
body 7 x 7 x 1.4 mm
SOT414-1
Hx
Gx
P2
P1
(0.125)
Hy Gy
By Ay
C
solder land
occupied area
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
DIMENSIONS in mm
P1
P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.400 0.430 9.700 9.700 7.300 7.300 1.200 0.240 0.300 7.500 7.500 9.950 9.950
Fig. 2. Reflow soldering footprint for LQFP64 (SOT414-1)
sot414-1_fr
SOT414-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved
3/5




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