Document
HT81xxx EasyVoiceTM Speech
Features
· Operating voltage: 2.4V~5V · Directly drives an external transistor · PWM function directly driver speaker
· Low standby current (1mA typ. for VDD=3V) · Minimal external components · 240 notes table ROM for key functions · Programmable silence length and end-pulse width
(minimal end-pulse width is 1.3ms at 8kHz sampling rate) · Controllable volume · FLAG1 options - End-pulse output - 3Hz, 3HzB flash - 6Hz, 6HzB flash - Busy output - OFF · FLAG2 options - 3Hz flash - 6Hz flash - Busy output - OFF
· 6 keys (Directed)
· 8 keys (Matrix key)
· Key options
- Sequential/Directed - Repeat (KEY2~KEY6) - STOP key (KEY6) - Key debounce time: 1.2ms, 22ms, 45ms
(based on a 8kHz sampling rate) - One shot/Normal - Pull-high resistance: 0, 50kW, 100kW, 200kW · Section options
- Retriggerable - Non-retriggerable · Package types: HT81006/009/012/018: 16-pin DIP package HT81R09/R18/R36: 16-pin SOP package
Applications
· Leisure products · Alarm clocks
· Alert and warning system · Sound effect generators
General Description
The EasyVoiceTM is a single-chip voice synthesizer LSI . The chip when triggered drives a speaker directly or through an external transistor with a PWM output. Negligible current is consumed in the standby state.
The HT81xxx provides direct key or Matrix key input and 2 programmable FLAG outputs. With 2.4V~5.0V power supply, a complete synthesized voice playback system can be easily built with very few external components.
The customer¢s voice sources are recorded section by section into an internal mask ROM. The instructions of section playback arrangement of each key are stored in the table ROM. The key features are also programmable. With such a flexible structure, the EasyVoiceTM is excellent for versatile voice applications.
Selection Table
Part No.
Mask OTP
HT81003 HT81R03
HT81006
HT81009 HT81R09
HT81012
HT81018 HT81R18
Voice Capacity
3 sec
6 sec
9 sec
12 sec
18 sec
Note: The voice capacity is calculated based on 5kHz sampling rate. For 3-second capacity HT81003/HT81R03 devices, refer to the its relevant data sheet.
HT81R36 36 sec
EasyVoiceTM is a trademark of Holtek Semiconductor Inc.
Rev. 1.60
1
May 25, 2018
Block Diagram
I/O 1 I/O 2 K E Y 1~4
O SCI
D ebounce C ir c u it
O s c illa to r C ir c u it
O n e -s h o t
T im e B a s e G e n e ra to r
A u d io C o n tr o lle r
R O M A d d re s s C o u n te r
S ta tu s D is p la y C o n tr o lle r
D a ta R O M
S e le c to r
VDD VSS
O U T1 O U T2 O U T3
HT81xxx
Pin Assignment
I/O 2 1 I/O 1 2 KEY4 3 KEY3 4 VDD 5 O SCI 6 KEY1 7 KEY2 8
16 N C 15 N C 14 V S S 13 O U T1 12 V D D 11 O U T2 10 V S S
9 O U T3
H T 8 1 0 0 6 /H T 8 1 0 0 9 H T 8 1 0 1 2 /H T 8 1 0 1 8
1 6 D IP -A
Pad Assignment
HT81006/HT81009
I/O 2 1 I/O 1 2 KEY4 3 KEY3 4 VDD 5 O SCI 6 KEY1 7 KEY2 8
16 V P P 15 O E 14 V S S 13 O U T1 12 V D D 11 O U T2 10 V S S
9 O U T3
H T 8 1 R 0 9 /H T 8 1 R 1 8 /H T 8 1 R 3 6 1 6 S O P -A
I/O 2
I/O 1 KEY4 KEY3 VDD
O SCI
1 14 V S S
2 (0 ,0 )
3
4
13
O U T1
5
12
VDD
6
7 8 9 10 11
O U T2
VSS
O U T3 KEY2 KEY1
Rev. 1.60
Chip size: 41.9 ´ 70.3 (mil)2 * The IC substrate should be connected to VSS in the PCB layout artwork.
2
May 25, 2018
HT81012/HT81018
HT81xxx
I/O 2 I/O 1 KEY4 KEY3 VDD
O SCI
1
(0 ,0 )
14 VSS
2
3
4
13
O U T1
5
12
VDD
6
7 8 9 10 11
O U T2
VSS
O U T3 KEY2 KEY1
Chip size: 41.9 ´ 84.4 (mil)2 * The IC substrate should be connected to VSS in the PCB layout artwork.
Rev. 1.60
3
May 25, 2018
HT81R09
HT81xxx
(0 ,0 )
I/O 2
1
I/O 1
2
KEY3
3
KEY4
4
VDD
5
O SCI
6
7 8 9 10
16
VPP
15
OE
14
VSS
13
O U T1
12
VDD
11
O U T2
VSS O U T3 KEY2 KEY1
Chip size: 51 ´ 102.8 (mil)2 * The IC substrate should be connected to VSS in the PCB layout artwork.
Rev. 1.60
4
May 25, 2018
HT81R18
HT81xxx
(0 ,0 )
I/O 2
1
I/O 1
2
KEY4
3
KEY3
4
VDD
5
O SCI
6
7 8 9 10
16
VPP
15
OE
14
VSS
13
O U T1
12
VDD
11
O U T2
VSS O U T3 KEY2 KEY1
Chip size: 51.6 ´ 138 (mil)2 * The IC substrate should be connected to VSS in the PCB layout artwork.
Rev. 1.60
5
May 25, 2018
HT81R36
OE VPP
I/O 2 I/O 1 KEY4
1
16
15
HT81xxx
14
13
(0 ,0 )
KEY3
2
VDD
3
4
5
6
7
8
9
12
VSS
11
O U T1
10
VDD
O U T2 VSS O U T3 KEY2 KEY1 O SCI
Chip size: 96.5 ´ 121.1 (mil)2 * The IC substrate should be connected to VSS in the PCB layout artwork.
Rev. 1.60
6
May 25, 2018
Pad Coordinates
HT81006/HT81009
Pad No.
1 2 3 4 5 6 7
X
-342.450 -342.450 -342.450 -342.450 -364.900 -376.670 -198.050
HT81012/HT81018
Pad No. 1 2 3 4 5 6 7
X
-342.400 -342.400 -342.400 -342.400 -364.850 -376.620 -198.000
HT81R09
Pad No. 1 2 3 4 5 6 7 8
X
-477.700 -477.700 -477.700 -477.700 -396.450 -476.100 -250.400 -150.400
HT81R18
Pad No. 1 2 3 4 5 6 7 8
X
-485.200 -485.200 -485.200 -485.200 -403.950 -483.600 -257.900 -157.900
Y 254.150 124.150 -7.700 -135.000 -272.350 -495.876 -672.700
Y 74.150 -55.850 -187.700 -315.000 -452.