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R7FA6M5AH2CBG Dataheets PDF



Part Number R7FA6M5AH2CBG
Manufacturers Renesas
Logo Renesas
Description Microcontrollers
Datasheet R7FA6M5AH2CBG DatasheetR7FA6M5AH2CBG Datasheet (PDF)

Datasheet RA6M5 Group Renesas Microcontrollers R01DS0366EJ0130 Rev.1.30 Jul 28, 2023 High-performance 200 MHz Arm Cortex-M33 core, up to 2 MB code flash memory with Dual-bank, background and SWAP operation, 8 KB Data flash memory, and 512 KB SRAM with Parity/ECC. High-integration with Ethernet MAC controller, USB 2.0 High-Speed, CAN FD, SDHI, Quad and Octa SPI, and advanced analog. Integrated Secure Crypto Engine with cryptography accelerators, key management support, tamper detection and pow.

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Datasheet RA6M5 Group Renesas Microcontrollers R01DS0366EJ0130 Rev.1.30 Jul 28, 2023 High-performance 200 MHz Arm Cortex-M33 core, up to 2 MB code flash memory with Dual-bank, background and SWAP operation, 8 KB Data flash memory, and 512 KB SRAM with Parity/ECC. High-integration with Ethernet MAC controller, USB 2.0 High-Speed, CAN FD, SDHI, Quad and Octa SPI, and advanced analog. Integrated Secure Crypto Engine with cryptography accelerators, key management support, tamper detection and power analysis resistance in concert with Arm TrustZone for integrated secure element functionality. Features ■ Arm® Cortex®-M33 Core ● Armv8-M architecture with the main extension ● Maximum operating frequency: 200 MHz ● Arm Memory Protection Unit (Arm MPU) – Protected Memory System Architecture (PMSAv8) – Secure MPU (MPU_S): 8 regions – Non-secure MPU (MPU_NS): 8 regions ● SysTick timer – Embeds two Systick timers: Secure and Non-secure instance – Driven by LOCO or system clock ● CoreSight™ ETM-M33 ■ Memory ● Up to 2-MB code flash memory ● 8-KB data flash memory (100,000 program/erase (P/E) cycles) ● 512-KB SRAM ■ Connectivity ● Serial Communications Interface (SCI) × 10 – Asynchronous interfaces – 8-bit clock synchronous interface – Smart card interface – Simple IIC – Simple SPI – Manchester coding (SCI3, SCI4) ● I2C bus interface (IIC) × 3 ● Serial Peripheral Interface (SPI) × 2 ● Quad Serial Peripheral Interface (QSPI) ● Octa Serial Peripheral Interface (OSPI) ● USB 2.0 Full-Speed Module (USBFS) ● USB 2.0 High-Speed Module (USBHS) ● CAN with Flexible Data-rate (CANFD) × 2 ● Ethernet MAC/DMA Controller (ETHERC/EDMAC) ● SD/MMC Host Interface (SDHI) ● Serial Sound Interface Enhanced (SSIE) ● Consumer Electronics Control (CEC) ■ Analog ● 12-bit A/D Converter (ADC12) × 2 – 5 Msps at interleaving ● 12-bit D/A Converter (DAC12) × 2 ● Temperature Sensor (TSN) ● Realtime Clock (RTC) with calendar and VBATT support ● Event Link Controller (ELC) ● Data Transfer Controller (DTC) ● DMA Controller (DMAC) × 8 ● Power-on reset ● Low Voltage Detection (LVD) with voltage settings ● Watchdog Timer (WDT) ● Independent Watchdog Timer (IWDT) ■ Human Machine Interface (HMI) ● Capacitive Touch Sensing Unit (CTSU) ■ Multiple Clock Sources ● Main clock oscillator (MOSC) (8 to 24 MHz) ● Sub-clock oscillator (SOSC) (32.768 kHz) ● High-speed on-chip oscillator (HOCO) (16/18/20 MHz) ● Middle-speed on-chip oscillator (MOCO) (8 MHz) ● Low-speed on-chip oscillator (LOCO) (32.768 kHz) ● IWDT-dedicated on-chip oscillator (15 kHz) ● Clock trim function for HOCO/MOCO/LOCO ● PLL/PLL2 ● Clock out support ■ General-Purpose I/O Ports ● 5-V tolerance, open drain, input pull-up, switchable driving ability ■ Operating Voltage ● VCC: 2.7 to 3.6 V ■ Operating Temperature and Packages ● Ta = -40℃ to +105℃ – 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch) – 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch) – 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) – 144-pin BGA (7 mm × 7 mm, 0.5 mm pitch) ● Ta = -40℃ to +85.


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