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Part

MIMXRT1175DVMAA

Description

i.MX RT1170 Crossover Processors



Feature


NXP Semiconductors Data Sheet: Technical Data Document Number: IMXRT1170CEC Re v. 1, 05/2021 i.MX RT1170 Crossover Pr ocessors Data Sheet for Consumer Produc ts MIMXRT1176DVMAA MIMXRT1172DVMAA MIM XRT117HDVMAA MIMXRT1175DVMAA MIMXRT117 1DVMAA MIMXRT117FDVMAA Package Informa tion Plastic Package 289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch Ordering Inform ation 1 i.MX RT11.
Manufacture

NXP

Datasheet
Download MIMXRT1175DVMAA Datasheet


NXP MIMXRT1175DVMAA

MIMXRT1175DVMAA; 70 introduction See Table 1 on page 6 The i.MX RT1170 is a new high-end proce ssor of i.MX RT family, which features NXP’s advanced implementation of a hi gh performance Arm Cortex®-M7 core ope rating at speeds up to 1 GHz and a powe r efficient Cortex®-M4 core up to 400 MHz. The i.MX RT1170 processor has 2 MB on-chip RAM in total, including a 768 KB RAM which can be fl.


NXP MIMXRT1175DVMAA

exibly configured as TCM (512 KB RAM sha red with M7 TCM and 256 KB RAM shared w ith M4 TCM) or general-purpose on-chip RAM. The i.MX RT1170 integrates advance d power management module with DCDC and LDO regulators that reduce complexity of external power supply and simplifies power sequencing. The i.MX RT1170 also provides various memory interfaces, in cluding SDRAM, RAW.


NXP MIMXRT1175DVMAA

NAND FLASH, NOR FLASH, SD/eMMC, Quad/Oc tal SPI, Hyper RAM/Flash, and a wide ra nge of other interfaces for connecting peripherals, such as WLAN, Bluetooth™ , GPS, displays, and camera sensors. Th e i.MX RT1170 also has rich audio and v ideo features, including MIPI CSI/DSI, LCD display, graphic accelerator, camer a interface, SPDIF, and I2S audio inter face. 1. i.MX RT117.




Part

MIMXRT1175DVMAA

Description

i.MX RT1170 Crossover Processors



Feature


NXP Semiconductors Data Sheet: Technical Data Document Number: IMXRT1170CEC Re v. 1, 05/2021 i.MX RT1170 Crossover Pr ocessors Data Sheet for Consumer Produc ts MIMXRT1176DVMAA MIMXRT1172DVMAA MIM XRT117HDVMAA MIMXRT1175DVMAA MIMXRT117 1DVMAA MIMXRT117FDVMAA Package Informa tion Plastic Package 289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch Ordering Inform ation 1 i.MX RT11.
Manufacture

NXP

Datasheet
Download MIMXRT1175DVMAA Datasheet




 MIMXRT1175DVMAA
NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMXRT1170CEC
Rev. 1, 05/2021
i.MX RT1170 Crossover
Processors Data Sheet
for Consumer Products
MIMXRT1176DVMAA
MIMXRT1172DVMAA
MIMXRT117HDVMAA
MIMXRT1175DVMAA
MIMXRT1171DVMAA
MIMXRT117FDVMAA
Package Information
Plastic Package
289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch
Ordering Information
1 i.MX RT1170 introduction
See Table 1 on page 6
The i.MX RT1170 is a new high-end processor of i.MX
RT family, which features NXP’s advanced
implementation of a high performance Arm
Cortex®-M7 core operating at speeds up to 1 GHz and a
power efficient Cortex®-M4 core up to 400 MHz.
The i.MX RT1170 processor has 2 MB on-chip RAM in
total, including a 768 KB RAM which can be flexibly
configured as TCM (512 KB RAM shared with M7 TCM
and 256 KB RAM shared with M4 TCM) or
general-purpose on-chip RAM. The i.MX RT1170
integrates advanced power management module with
DCDC and LDO regulators that reduce complexity of
external power supply and simplifies power sequencing.
The i.MX RT1170 also provides various memory
interfaces, including SDRAM, RAW NAND FLASH,
NOR FLASH, SD/eMMC, Quad/Octal SPI, Hyper
RAM/Flash, and a wide range of other interfaces for
connecting peripherals, such as WLAN, Bluetooth™,
GPS, displays, and camera sensors. The i.MX RT1170
also has rich audio and video features, including MIPI
CSI/DSI, LCD display, graphic accelerator, camera
interface, SPDIF, and I2S audio interface.
1. i.MX RT1170 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6
1.3. Package marking information . . . . . . . . . . . . . . . . 9
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. Special signal considerations . . . . . . . . . . . . . . . 20
3.2. Recommended connections for unused analog
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 24
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 36
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 54
4.5. External memory interface . . . . . . . . . . . . . . . . . . 58
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 68
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 85
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . 103
5.1. Boot mode configuration pins . . . . . . . . . . . . . . 103
5.2. Boot device interface allocation . . . . . . . . . . . . . 103
6. Package information and contact assignments . . . . . . 109
6.1. 14 x 14 mm package information . . . . . . . . . . . . 109
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.
© 2020-2021 NXP B.V.




 MIMXRT1175DVMAA
i.MX RT1170 introduction
The i.MX RT1170 is specifically useful for applications such as:
• Industrial Human Machine Interfaces (HMI)
• Motor Control
• Home Appliance
• High-end Audio Appliance
• Low-end Instrument Cluster
• Point-of-Sale (PoS)
1.1 Features
The i.MX RT1170 processors are based on Arm Cortex®-M7 Core™ Platform, which has the following
features:
• The Arm Cortex-M7 Core Platform:
— 32 KB L1 Instruction Cache and 32 KB L1 Data Cache
— Floating Point Unit (FPU) with single-precision and double-precision support of Armv7-M
Architecture FPv5
— Support the Arm®v7-M Thumb instruction set, defined in the Armv7-M architecture
— Integrated Memory Protection Unit (MPU), up to 16 individual protection regions
— Up to 512 KB I-TCM and D-TCM in total
— Frequency of 1 GHz with Forward Body Biasing (FBB)
— Frequency of the core, as per Table 11, "Operating ranges," on page 27.
• The Arm Cortex®-M4 Core platform:
— Cortex-M4 processor with single-precision FPU defined by Armv7-M architecture FPv4-SP
— Integrated MPU with 8 individual protection regions
— 16 KB Instruction Cache, 16 KB Data Cache, and 256 KB TCM
— Frequency of 400 MHz without body biasing
The SoC-level memory system consists of the following additional components:
— Boot ROM (256 KB)
— On-chip RAM (2 MB in total)
– Configurable 512 KB RAM shared with M7 TCM
– 256 KB RAM shared with M4 TCM
– Dedicated 1.25 MB OCRAM
— Secure always-on RAM (4 KB)
• External memory interfaces:
— 8/16/32-bit SDRAM, up to SDRAM-133/SDRAM-166/SDRAM-200
— 8/16-bit SLC NAND FLASH
— SD/eMMC
— SPI NOR/NAND FLASH
i.MX RT1170 Crossover Processors Data Sheet for Consumer Products, Rev. 1, 05/2021
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NXP Semiconductors




 MIMXRT1175DVMAA
i.MX RT1170 introduction
— Parallel NOR FLASH with XIP support
— Single/Dual channel Quad SPI FLASH with XIP support
— Hyper RAM/FLASH
— OCT FLASH
— Synchronization mode for all devices
• Timers and PWMs:
— Six General Programmable Timer (GPT) modules
– 4-channel generic 32-bit resolution timer for each
– Each supports standard capture and compare operation
— Two Periodical Interrupt Timer (PIT) modules
– Four timers for each module
– Generic 32-bit resolution timer
– Periodical interrupt generation
— Four Quad Timer (QTimer) modules
– 4-channel generic 16-bit resolution timer for each
– Each supports standard capture and compare operation
– Quadrature decoder integrated
— Four FlexPWMs
– Up to 8 individual PWM channels for each
– 16-bit resolution PWM suitable for Motor Control applications
— Four Quadrature Decoders
— Four Watch Dog (WDOG) modules
Each i.MX RT1170 processor enables the following interfaces to external devices (some of them are
muxed and not available simultaneously):
• Display Interface:
— Parallel RGB LCD interface (eLCDIF)
– Support 8/16/24-bit interface
– Support up to WXGA resolution @60fps
– Support Index color with 256 entry x 24-bit color LUT
— Parallel RGB LCD Interface Version 2 (LCDIFv2)
– Enhanced based on LCDIF version
– Support up to 8 layers of alpha blending
— MIPI Display Serial Interface (MIPI DSI)
– PHY integrated
– 2 data lanes interface with up to 1.5 GHz bit rate clock
— Smart LCD Display with 8080 interface through SEMC
• Audio:
i.MX RT1170 Crossover Processors Data Sheet for Consumer Products, Rev. 1, 05/2021
NXP Semiconductors
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