Triple Inverter Gate
SN74LVC3G04
www.ti.com
SCES363L – AUGUST 2001 – REVISED NOVEMBER 2013
Triple Inverter Gate
Check for Samples: SN74LVC...
Description
SN74LVC3G04
www.ti.com
SCES363L – AUGUST 2001 – REVISED NOVEMBER 2013
Triple Inverter Gate
Check for Samples: SN74LVC3G04
FEATURES
1
2 Available in the Texas Instruments NanoFree™ Package
Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V
Max tpd of 4.1 ns at 3.3 V Low Power Consumption, 10-µA Max ICC ±24-mA Output Drive at 3.3 V
Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Live Insertion, Partial-PowerDown Mode, and Back-Drive Protection
Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down to the VCC Level
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION
This triple inverter is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC3G04 device performs the Boolean function Y = A.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
DCT PACKAGE (TOP VIEW)
1A
1
3Y
2
2A
3
GND
4
8
VCC
7
1Y
6
3A
5
2Y
DCU PACKAGE (TOP VIEW)
1A 1 3Y 2 2A 3 GND 4
8
VCC
7 1Y
6 3A
5 2Y
YZP PACKAGE (BOTTOM VIE...
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