BiCMOS Design Substantially Reduces ICCZ Functionally Equivalent to ′ALS29863 and
AMD Am29863A
Power-Up High-Impedance State ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015
Package Options Include Plastic
Small-Outline Packages (DW), Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)
des...
