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TLV379 Dataheets PDF



Part Number TLV379
Manufacturers Texas Instruments
Logo Texas Instruments
Description Rail-to-Rail I/O Operational Amplifiers
Datasheet TLV379 DatasheetTLV379 Datasheet (PDF)

Product Folder Order Now Technical Documents Tools & Software Support & Community TLV379, TLV2379, TLV4379 SBOS785B – APRIL 2016 – REVISED AUGUST 2017 TLVx379 Cost-Optimized, Low-Voltage, 4-µA, Rail-to-Rail I/O Operational Amplifiers 1 Features •1 Cost-Optimized Precision Amplifiers • microPower: 4 μA (Typical) • Low Offset Voltage: 0.8 mV (Typical) • Rail-to-Rail Input and Output • Unity-Gain Stable • Wide Supply Voltage Range: 1.8 V to 5.5 V • microSize Packages: – 5-Pin SC70 – 5-Pin SOT.

  TLV379   TLV379


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Product Folder Order Now Technical Documents Tools & Software Support & Community TLV379, TLV2379, TLV4379 SBOS785B – APRIL 2016 – REVISED AUGUST 2017 TLVx379 Cost-Optimized, Low-Voltage, 4-µA, Rail-to-Rail I/O Operational Amplifiers 1 Features •1 Cost-Optimized Precision Amplifiers • microPower: 4 μA (Typical) • Low Offset Voltage: 0.8 mV (Typical) • Rail-to-Rail Input and Output • Unity-Gain Stable • Wide Supply Voltage Range: 1.8 V to 5.5 V • microSize Packages: – 5-Pin SC70 – 5-Pin SOT-23 – 8-Pin SOIC – 14-Pin TSSOP 2 Applications • Power Banks • Solar Inverters • Low-Power Motor Controls • Battery-Powered Instruments • Portable Devices • Medical Instruments • Handheld Test Equipment 3 Description The TLV379 family of single, dual, and quad operational amplifiers represents a cost-optimized generation of low-voltage and micropower amplifiers. Operating on a supply voltage as low as 1.8 V (±0.9 V) and consuming extremely low quiescent current of 4 µA per channel, these amplifiers are wellsuited for power-sensitive applications. In addition, the rail-to-rail input and output capability allows the TLV379 family to be used in virtually any singlesupply application. The TLV379 (single) is available in 5-pin SC70 and SOT23, and 8-pin SOIC packages. The TLV2379 (dual) comes in an 8-pin SOIC package. The TLV4379 (quad) is offered in a 14-pin TSSOP package. All versions are specified from –40°C to +125°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) SC70 (5) 2.00 mm × 1.25 mm TLV379 SOT-23 (5) 2.90 mm × 1.60 mm SOIC (8) 4.90 mm × 3.91 mm TLV2379 SOIC (8) 4.90 mm × 3.91 mm TLV4379 TSSOP (14) 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. TLV379 in a Battery-Monitoring Application + VBATT R1 IBIAS RBIAS R2 REF1112 RF +IN TLV379 -IN OUT VREF VSTATUS Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TLV379, TLV2379, TLV4379 SBOS785B – APRIL 2016 – REVISED AUGUST 2017 www.ti.com Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Device Comparison Table..................................... 3 6 Pin Configuration and Functions ......................... 3 7 Specifications......................................................... 6 7.1 Absolute Maximum Ratings ...................................... 6 7.2 ESD Ratings.............................................................. 6 7.3 Recommended Operating Conditions....................... 6 7.4 Thermal Information: TLV379 ................................... 7 7.5 Thermal Information: TLV2379 ................................. 7 7.6 Thermal Information: TLV4379 ................................. 7 7.7 Electrical Characteristics: VS = 1.8 V to 5.5 V .......... 8 7.8 Typical Characteristics .............................................. 9 8 Detailed Description ............................................ 12 8.1 Overview ................................................................. 12 8.2 Functional Block Diagram ....................................... 12 8.3 Feature Description................................................. 12 8.4 Device Functional Modes........................................ 13 9 Application and Implementation ........................ 14 9.1 Application Information............................................ 14 9.2 Typical Application ................................................. 14 9.3 System Examples ................................................... 15 10 Power Supply Recommendations ..................... 17 10.1 Input and ESD Protection ..................................... 17 11 Layout................................................................... 18 11.1 Layout Guidelines ................................................. 18 11.2 Layout Example .................................................... 18 12 Device and Documentation Support ................. 19 12.1 Documentation Support ....................................... 19 12.2 Related Links ........................................................ 19 12.3 Receiving Notification of Documentation Updates 19 12.4 Community Resources.......................................... 19 12.5 Trademarks ........................................................... 19 12.6 Electrostatic Discharge Caution ............................ 19 12.7 Glossary ................................................................ 19 13 Mechanical, Packaging, and Orderable.


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