UT190

Cree® UltraThin® UT190™ Gen 3 LEDs CxxxUT190-Sxxxx-31 Data Sheet (50 µm chip thickness) Cree’s UT190 LEDs combine highly efficient InGaN materials with Cree’s proprietary GSiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small and thin with low forward voltage. Cree’s UT™ series chips are 100% tested for conformity to optical and electrical specifications, as well as the ability to withstand a 2000 V ESD pulse. Applications include consumer products, mobile devices and automotive applications where a small, thin form factor is required. FEATURES Wavelengths for Blue, Green and White-conversion 50 mm Chip Thickness RF Performance: – 450 nm – 12+ mW – 460 nm – 10+ mW – 470 nm – 10+ mW – 527 nm – 4+ mW Low Forward Voltage – 2.9 V Typical at 5 mA Conductive Adhesive Die Attach Single Wire Bond, Vertically Conductive Structure 2kV Class 2 ESD Rating CxxxUT190-Sxxxx-31 Chip Diagram APPLICATIONS Indicator Applications – Consumer Products – Mobile Devices – Product Displays – White Goods Automotive Applications – Interior Indicators – Meter Cluster Lighting – Center Stack Displays Top View Anode (+), Ф85 mm (Bonding area, Ф70 mm) Junction, 160 x 160 mm Thickness, 50 mm Side View 190 x 190 mm Cathode (-) 80 x 80 mm Bottom Surface 150 x 150 mm Bottom View Subject to change without notice. www.cree.com 1 Data Sheet: CPR3EP Rev D Maximum Ratings at TA = 25°C Notes 1&3 DC Forward Cu...