LED
Cree® UltraThin® Gen 3 LEDs
Data Sheet CxxxUT170-Sxxxx-31
Cree’s UltraThin® LEDs combine highly efficient InGaN material...
Description
Cree® UltraThin® Gen 3 LEDs
Data Sheet CxxxUT170-Sxxxx-31
Cree’s UltraThin® LEDs combine highly efficient InGaN materials with Cree’s proprietary GSiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications, as well as the ability to withstand 2000 V ESD. Applications include consumer products, mobile devices and automotive applications where a small, thin form factor is required.
FEATURES
Small Chip – 170 x 170 x 50 μm Single Wire Bond Structure UT LED Performance
– 450 nm – 12+ mW – 460 nm – 10+ mW – 470 nm – 10+ mW – 527 nm – 4+ mW Low Forward Voltage – 2.9 V Typical at 5 mA 2kV Class 2 ESD Rating
APPLICATIONS
Indicator Applications – Consumer Products – Mobile Devices – Product Displays – White Goods
Automotive Applications – Interior Indicators – Meter Cluster Lighting – Center Stack Displays
CxxxUT170-Sxxxx-31 Chip Diagram
Top View
Anode (+), Ф85 µm (Bonding area, Ф70 µm) Junction, 140 x 140 µm
Thickness 50 µm
Side View
170 x 170 µm
Bottom Surface 130 x 130 µm
Cathode (-) 80 x 80 µm
Bottom View
Subject to change without notice. www.cree.com
1
Data Sheet: CPR3GQ Rev. A
Maximum Ratings at TA = 25°C Notes 1&3 DC Forward Current Peak Forward Current (1/10 duty cycle @ 1 kHz) LED Junction Temperature Reverse Voltage Operating Temperature Range LED Chip Stora...
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