C527UT170

Cree® UltraThin® Gen 3 LEDs Data Sheet CxxxUT170-Sxxxx-31 Cree’s UltraThin® LEDs combine highly efficient InGaN materials with Cree’s proprietary GSiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications, as well as the ability to withstand 2000 V ESD. Applications include consumer products, mobile devices and automotive applications where a small, thin form factor is required. FEATURES Small Chip – 170 x 170 x 50 μm Single Wire Bond Structure UT LED Performance – 450 nm – 12+ mW – 460 nm – 10+ mW – 470 nm – 10+ mW – 527 nm – 4+ mW Low Forward Voltage – 2.9 V Typical at 5 mA 2kV Class 2 ESD Rating APPLICATIONS Indicator Applications – Consumer Products – Mobile Devices – Product Displays – White Goods Automotive Applications – Interior Indicators – Meter Cluster Lighting – Center Stack Displays CxxxUT170-Sxxxx-31 Chip Diagram Top View Anode (+), Ф85 µm (Bonding area, Ф70 µm) Junction, 140 x 140 µm Thickness 50 µm Side View 170 x 170 µm Bottom Surface 130 x 130 µm Cathode (-) 80 x 80 µm Bottom View Subject to change without notice. www.cree.com 1 Data Sheet: CPR3GQ Rev. A Maximum Ratings at TA = 25°C Notes 1&3 DC Forward Current Peak Forward Current (1/10 duty cycle @ 1 kHz) LED Junction Temperature Reverse Voltage Operating Temperature Range LED Chip Stora...