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FDC6329L Dataheets PDF



Part Number FDC6329L
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Integrated Load Switch
Datasheet FDC6329L DatasheetFDC6329L Datasheet (PDF)

Integrated Load Switch FDC6329L Description This device is particularly suited for compact power management in portable electronic equipment where 2.5 V to 8 V input and 2.5 A output current capability are needed. This load switch integrates a small N−Channel power MOSFET (Q1) which drives a large P−Channel power MOSFET (Q2) in one tiny SUPERSOTTM−6 package. Features • VDROP = 0.20 V @ VIN = 5 V, IL = 2.8 A, R(on) = 0.07 W • VDROP = 0.20 V @ VIN = 2.5 V, IL = 1.9 A, R(on) = 0.105 W • Control MO.

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Integrated Load Switch FDC6329L Description This device is particularly suited for compact power management in portable electronic equipment where 2.5 V to 8 V input and 2.5 A output current capability are needed. This load switch integrates a small N−Channel power MOSFET (Q1) which drives a large P−Channel power MOSFET (Q2) in one tiny SUPERSOTTM−6 package. Features • VDROP = 0.20 V @ VIN = 5 V, IL = 2.8 A, R(on) = 0.07 W • VDROP = 0.20 V @ VIN = 2.5 V, IL = 1.9 A, R(on) = 0.105 W • Control MOSFET (Q1) Includes Zener Protection for ESD Ruggedness (> 6 kV Human Body Model) • High Performance Trench Technology for Extremely Low On−Resistance • SUPERSOT−6 Package Design Using Copper Lead Frame for Superior Thermal and Electrical Capabilities • This is a Pb−Free and Halide Free Device VIN,R1 4 ON/OFF 5 R1, C1 6 Q2 Q1 3 VOUT, C1 2 VOUT, C1 1 R2 See Application Circuit (Figure 3) Figure 1. www.onsemi.com TSOT−23−6 CASE 419BL MARKING DIAGRAM &E&Y &.329&G &E = Designates Space &Y = Binary Calendar Year Coding Scheme &. = Pin One Dot 329 = Specific Device Code &G = Date Code ORDERING INFORMATION Device FDC6329L Package TSOT−23−6 (Pb−Free) Shipping† 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. VDROP + − IN OUT ON/OFF Figure 2. Equivalent Circuit © Semiconductor Components Industries, LLC, 1998 1 June, 2021 − Rev. 4 Publication Order Number: FDC6329L/D FDC6329L ABSOLUTE MAXIMUM RATINGS TA = 25°C unless otherwise noted Symbol Parameter Value Unit VIN VON/OFF IL Input Voltage Range (Note 1) On/Off Voltage Range Load Current − Continuous (Note 2) Load Current − Pulsed 2.5−8 V 1.5−8 V 2.5 A 10 PD TJ, TSTG ESD Maximum Power Dissipation (Note 2) Operating and Storage Temperature Range Electrostatic Discharge Rating MIL−STD−883D Human Body Model (100 pF / 1500 W) 0.7 W −55 to 150 °C 6 kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS TA = 25°C unless otherwise noted Symbol Parameter RqJA Thermal Resistance, Junction−to−Ambient (Note 2) RqJC Thermal Resistance, Junction−to−Case (Note 2) Value 180 60 Unit °C/W °C/W ELECTRICAL CHARACTERISTICS TA = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Unit OFF CHARACTERISTICS IFL Forward Leakage Current ON CHARACTERISTICS (Note 3) VIN = 8 V, VON/OFF = 0 V − − 1 mA VDROP Conduction Voltage VIN = 5 V, VON/OFF = 3.3 V, IL = 2.8 A − 0.12 0.2 V VIN = 2.5 V, VON/OFF = 3.3 V, IL = 1.9 A − 0.14 0.2 RDS(on) Q2 − Static On−Resistance VGS = −5 V, ID = −2.5 A − 0.047 0.07 W VGS = −2.5 V, ID = −2.0 A − 0.073 0.105 IL Load Current VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V 2.8 .


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