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R7FA6M3AF2CBG Dataheets PDF



Part Number R7FA6M3AF2CBG
Manufacturers Renesas
Logo Renesas
Description 32-bit MCU
Datasheet R7FA6M3AF2CBG DatasheetR7FA6M3AF2CBG Datasheet (PDF)

Cover Datasheet Renesas RA6M3 Group 32 32-Bit MCU Renesas Advanced (RA) Family Renesas RA6 Series Datasheet All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp. website (http://www.r.

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Cover Datasheet Renesas RA6M3 Group 32 32-Bit MCU Renesas Advanced (RA) Family Renesas RA6 Series Datasheet All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by Renesas Electronics Corp. without notice. Please review the latest information published by Renesas Electronics Corp. through various means, including the Renesas Electronics Corp. website (http://www.renesas.com). www.renesas.com Rev.1.10 Dec 2020 RA6M3 Group Datasheet Leading performance 120-MHz Arm® Cortex®-M4 core, up to 2-MB code flash memory, 640-KB SRAM, Graphics LCD Controller, 2D Drawing Engine, Capacitive Touch Sensing Unit, Ethernet MAC Controller with IEEE 1588 PTP, USB 2.0 High-Speed, USB 2.0 Full-Speed, SDHI, Quad SPI, security and safety features, and advanced analog. Features ■ Arm Cortex-M4 Core with Floating Point Unit (FPU)  Armv7E-M architecture with DSP instruction set  Maximum operating frequency: 120 MHz  Support for 4-GB address space  On-chip debugging system: JTAG, SWD, and ETM  Boundary scan and Arm Memory Protection Unit (Arm MPU) ■ Memory  Up to 2-MB code flash memory (40 MHz zero wait states)  64-KB data flash memory (125,000 erase/write cycles)  Up to 640-KB SRAM  Flash Cache (FCACHE)  Memory Protection Units (MPU)  Memory Mirror Function (MMF)  128-bit unique ID ■ Connectivity  Ethernet MAC Controller (ETHERC)  Ethernet DMA Controller (EDMAC)  Ethernet PTP Controller (EPTPC)  USB 2.0 High-Speed (USBHS) module - On-chip transceiver with voltage regulator - Compliant with USB Battery Charging Specification 1.2  USB 2.0 Full-Speed (USBFS) module - On-chip transceiver with voltage regulator  Serial Communications Interface (SCI) with FIFO × 10  Serial Peripheral Interface (SPI) × 2  I2C bus interface (IIC) × 3  Controller Area Network (CAN) × 2  Serial Sound Interface Enhanced (SSIE) × 2  SD/MMC Host Interface (SDHI) × 2  Quad Serial Peripheral Interface (QSPI)  IrDA interface  Sampling Rate Converter (SRC)  External address space - 8-bit or 16-bit bus space is selectable per area - SDRAM support ■ Analog  12-bit A/D Converter (ADC12) with 3 sample-and-hold circuits each × 2  12-bit D/A Converter (DAC12) × 2  High-Speed Analog Comparator (ACMPHS) × 6  Programmable Gain Amplifier (PGA) × 6  Temperature Sensor (TSN) ■ Timers  General PWM Timer 32-bit Enhanced High Resolution (GPT32EH) × 4  General PWM Timer 32-bit Enhanced (GPT32E) × 4  General PWM Timer 32-bit (GPT32) × 6  Asynchronous General-Purpose Timer (AGT) × 2  Watchdog Timer (WDT) ■ Safety  Error Correction Code (ECC) in SRAM  SRAM parity error check  Flash area protection  ADC self-diagnosis function  Clock Frequency Accuracy Measurement Circuit (CAC)  Cyclic Redundancy Check (CRC) calculator  Data Operation Circuit (DOC)  Port Output Enable for GPT (POEG)  Independent Watchdog Timer (IWDT)  GPIO readback level detection  Register write protection  Main oscillator stop detection  Illegal memory access ■ System and Power Management  Low power modes  Realtime Clock (RTC) with calendar and VBATT support  Event Link Controller (ELC)  DMA Controller (DMAC) × 8  Data Transfer Controller (DTC)  Key Interrupt Function (KINT)  Power-on reset  Low Voltage Detection (LVD) with voltage settings ■ Security and Encryption  AES128/192/256  3DES/ARC4  SHA1/SHA224/SHA256/MD5  GHASH  RSA/DSA/ECC  True Random Number Generator (TRNG) ■ Human Machine Interface (HMI)  Graphics LCD Controller (GLCDC)  JPEG codec  2D Drawing Engine (DRW)  Capacitive Touch Sensing Unit (CTSU)  Parallel Data Capture Unit (PDC) ■ Multiple Clock Sources  Main clock oscillator (MOSC) (8 to 24 MHz)  Sub-clock oscillator (SOSC) (32.768 kHz)  High-speed on-chip oscillator (HOCO) (16/18/20 MHz)  Middle-speed on-chip oscillator (MOCO) (8 MHz)  Low-speed on-chip oscillator (LOCO) (32.768 kHz)  IWDT-dedicated on-chip oscillator (15 kHz)  Clock trim function for HOCO/MOCO/LOCO  Clock out support ■ General-Purpose I/O Ports  Up to 133 input/output pins - Up to 9 CMOS input - Up to 124 CMOS input/output - Up to 21 input/output 5 V tolerant - Up to 18 high current (20 mA) ■ Operating Voltage  VCC: 2.7 to 3.6 V ■ Operating Temperature and Packages  Ta = -40°C to +85°C - 176-pin BGA (13 mm × 13 mm, 0.8 mm pitch) - 145-pin LGA (7 mm × 7 mm, 0.5 mm pitch)  Ta = -40°C to +105°C - 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch) - 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch) - 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) R01DS0358EJ0110 Rev.1.10 Dec 25, 2020 Page 2 of 116 RA6M3 Group 1. Overview 1. Overview The MCU integrates multiple series of software- and pin-compatible Arm®-based 32-bit cores tha.


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