Document
Operational Amplifier, Rail-to-Rail Output, 3 MHz BW
TLV271, TLV272, NCV272, TLV274, NCV274
The TLV/NCV27x operational amplifiers provide rail−to−rail output operation. The output can swing within 320 mV to the positive rail and 50 mV to the negative rail. This rail−to−rail operation enables the user to make optimal use of the entire supply voltage range while taking advantage of 3 MHz bandwidth. The opamp can operate on supply voltage as low as 2.7 V over the temperature range of −40°C to 125°C. The high bandwidth provides a slew rate of 2.4 V/ms while only consuming 550 mA of quiescent current. Likewise the opamp can run on a supply voltage as high as 16 V (single) and 36 V (dual quad) making it ideal for a broad range of battery−operated applications. Since this is a CMOS device it has high input impedance and low bias currents making it ideal for interfacing to a wide variety of signal sensors. In addition it comes in a variety of compact packages with different pinout styles allowing for use in high−density PCB’s.
Features
• Rail−To−Rail Output • Wide Bandwidth: 3 MHz • High Slew Rate: 2.4 V/ms • Wide Power−Supply Range: 2.7 V to 16 V (TLV271),
36 V (TLV/NCV272/274)
• Low Supply Current: 550 mA • Low Input Bias Current: 45 pA • Wide Temperature Range: −40°C to 125°C • TSOP−5, Micro−8, SOIC−8, SOIC−14, TSSOP−14 Packages • NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Notebook Computers • Portable Instruments • Signal Conditioning • Automotive • Power Supplies • Current Sensing
www.onsemi.com
5 1
TSOP−5 CASE 483
Micro8 CASE 846A
8 1
SOIC−8 CASE 751
14 1
SOIC−14 NB CASE 751A
14
1 TSSOP−14 CASE 948G
DEVICE MARKING INFORMATION
See general marking information in the device marking section on page 2 of this data sheet.
ORDERING INFORMATION
See detailed ordering and shipping information on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
July, 2020 − Rev. 7
Publication Order Number: TLV271/D
TLV271, TLV272, NCV272, TLV274, NCV274
MARKING DIAGRAMS
Single Channel Configuration TLV271
5 XXXAYWG G
1
TSOP−5 CASE 483
XXX = ADG (TLV271SN1T1G)
= ADH (TLV271SN2T1G)
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Dual Channel Configuration TLV272, NCV272
8
V272 AYWG
G 1
8
V272 ALYW
G 1
Micro8 CASE 846A
SOIC−8 CASE 751
Quad Channel Configuration TLV274, NCV274
14
14
V274 ALYWG
G
V274G AWLYWW
1
1
TSSOP−14 CASE 948G
SOIC−14 NB CASE 751A
XXXXX = Specific Device Code
A
= Assembly Location
WL, L = Wafer Lot
Y
= Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
www.onsemi.com 2
TLV271, TLV272, NCV272, TLV274, NCV274
PIN CONNECTIONS
OUT 1
Single Channel Configuration TLV271
5 VEE
OUT 1
5 VDD
VDD 2
VEE 2.