Document
Device TLV2465A is Obsolete
TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA FAMILY OF LOWĆPOWER RAILĆTOĆRAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
D Rail-to-Rail Output Swing D Gain Bandwidth Product . . . 6.4 MHz D ± 80 mA Output Drive Capability D Supply Current . . . 500 µA/channel D Input Offset Voltage . . . 100 µV D Input Noise Voltage . . . 11 nV/√Hz D Slew Rate . . . 1.6 V/µs D Micropower Shutdown Mode
(TLV2460/3/5) . . . 0.3 µA/Channel
D Universal Operational Amplifier EVM D Available in Q-Temp Automotive
HighRel Automotive Applications Configuration Control/Print Support Qualification to Automotive Standards
TLV2460 DBV PACKAGE
(TOP VIEW)
OUT
1
6
VDD+
GND
2
5
SHDN
IN+
3
4
IN −
description
The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for portable applications. The input common-mode voltage range extends beyond the supply rails for maximum dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters.
The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500 µA of supply current, providing good ac performance with low power consumption. Three members of the family offer a shutdown terminal, which places the amplifier in an ultralow supply current mode (IDD = 0.3 µA/ch). While in shutdown, the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with an input noise voltage of 11 nV/√Hz and input offset voltage of 100 µV.
This family is available in the low-profile SOT23, MSOP, and TSSOP packages. The TLV2460 is the first rail-to-rail input/output operational amplifier with shutdown available in the 6-pin SOT23, making it perfect for high-density circuits. The family is specified over an expanded temperature range (TA = − 40°C to 125°C) for use in industrial control and automotive systems, and over the military temperature range (TA = −55°C to 125°C) for use in military systems.
DEVICE
VDD
VIO
[V]
[µV]
TLV246x(A) 2.7−6 150
TLV277x(A) 2.5−5.5 360
TLV247x(A) 2.7−6 250
TLV245x(A) 2.7−6
20
TLV225x(A) 2.7−8 200
TLV226x(A) 2.7−8 300
IDD/ch [µA] 550 1000 600 23 35 200
SELECTION GUIDE
IIB [pA]
GBW SLEW RATE
[MHz]
[V/µs]
1300
6.4
1.6
2
5.1
10.5
2.5
2.8
1.5
500
0.22
0.11
1
0.2
0.12
1
0.71
0.55
Vn, 1 kHz [nV/√Hz]
11 17 15 52 19 12
IO [mA]
25 6 20 10 3 3
SHUTDOWN
Y Y Y Y — —
RAIL-RAIL
I/O O I/O I/O — —
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
WWW.TI.COM
Copyright 1998−2004, Texas Instruments Incorporated On products compliant to MILĆPRFĆ38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
1
Device TLV2465A is Obsolete
TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA FAMILY OF LOWĆPOWER RAILĆTOĆRAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
TLV2460C/I/AI and TLV2461C/I/AI AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax AT 25°C
SMALL OUTLINE (D)
SOT-23† (DBV)
SYMBOL
PLASTIC DIP (P)
0°C to 70°C
2000 µV
TLV2460CD TLV2461CD
TLV2460CDBV TLV2461CDBV
VAOC VAPC
TLV2460CP TLV2461CP
−40°C to 125°C
2000 µV 1500 µV
TLV2460ID TLV2461ID
TLV2460AID TLV2461AID
TLV2460IDBV TLV2461IDBV
— —
VAOI VAPI
— —
TLV2460IP TLV2461IP
TLV2460AIP TLV2461AIP
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CDR). ‡ Chip forms are tested at TA = 25°C only.
TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS
TA
VIOmax AT 25°C
−40°C to 125°C
2000 µV 1500 µV
SMALL OUTLINE†
(D)
TLV2460QD TLV2461QD
TLV2460AQD TLV2461AQD
PACKAGED DEVICES
SMALL OUTLINE†
(PW)
CERAMIC DIP (JG)
TLV2460QPW
—
TLV2461QPW
—
TLV2460AQPW
—
TLV2461AQPW
—
CERAMIC FLATPACK
(U)
— —
— —
CHIP CARRIER (FK)
— —
— —
2000 µV
— —
−55°C to 125°C
1500 µV
— —
—
TLV2460MJG
TLV2460MU
TLV2460MFK
—
TLV2461MJG
TLV2461MU
TLV2461MFK
—
TLV2460AMJG TLV2460AMU
TLV2460AMFK
—
TLV2461AMJG TLV2461AMU
TLV2461A.