HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS
OBSOLETE - No Longer Available
TIBPAL16L8-5C, TIBPAL16R4-5C, TIBPAL16R6-5C, TIBPAL16R8-5C TIBPAL16L8-7M, TIBPAL16R4-7M, ...
Description
OBSOLETE - No Longer Available
TIBPAL16L8-5C, TIBPAL16R4-5C, TIBPAL16R6-5C, TIBPAL16R8-5C TIBPAL16L8-7M, TIBPAL16R4-7M, TIBPAL16R6-7M, TIBPAL16R8-7M
HIGH-PERFORMANCE IMPACT-X ™ PAL® CIRCUITS SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
High-Performance Operation:
fmax (no feedback) TIBPAL16R’ -5C Series . . . 125 MHz Min TIBPAL16R’ -7M Series . . . 100 MHz Min
fmax (internal feedback) TIBPAL16R’ -5C Series . . . 125 MHz Min TIBPAL16R’ -7M Series . . . 100 MHz Min
fmax (external feedback) TIBPAL16R’ -5C Series . . . 117 MHz Min TIBPAL16R’ -7M Series . . . 74 MHz Min
Propagation Delay TIBPAL16L8-5C Series . . . 5 ns Max TIBPAL16L8-7M Series . . . 7 ns Max TIBPAL16R’ -5C Series (CLK-to-Q) . . . 4 ns Max TIBPAL16R ’ -7M Series (CLK-to-Q) . . . 6.5 ns Max
Functionally Equivalent, but Faster than,
Existing 20-Pin PLDs
Preload Capability on Output Registers
Simplifies Testing
Power-Up Clear on Registered Devices (All
Register Outputs are Set Low, but Voltage Levels at the Output Pins Go High)
Package Options Include Both Plastic and
Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
Security Fuse Prevents Duplication
DEVICE
I
3-STATE
INPUTS O OUTPUTS
’PAL16L8
10
2
’PAL16R4
8
0
’PAL16R6
8
0
’PAL16R8
8
0
REGISTERED Q OUTPUTS
0 4 (3-state buffers) 6 (3-state buffers) 8 (3-state buffers)
I/O PORT
S
6
4
2
0
description
TIBPAL16L8’ C SUFFIX . . . J OR N PACKAGE
M SUFFIX . . . J PACKAGE
(TOP VIEW)
I1 I2 I3 I4 I5 I6 I7 I8 I9 GND 10
20...
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