MLPF-WB-02D3

MLPF-WB-02D3 Datasheet 2.4 GHz low pass filter matched to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages Chip scale package on glass 6 bumps Pin-out top diagram (top view - bumps down) OUT GND3 GND4 GND2 IN GND1 Product status link MLPF-WB-02D3 Features Integrated impedance matching to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages 50 Ω nominal impedance on antenna side Deep rejection harmonics filter Low insertion loss Small footprint Low profile ≤ 630 μm after reflow High RF performances RF BOM and area reduction ECOPACK2 compliant component Applications Bluetooth 5 OpenThread Zigbee® IEEE 802.15.4 Optimized for STM32WB5x and STM32WB1x in WLCSP and UFBGA packages Description The MLPF-WB-02D3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performances of STM32WB5x and STM32WB1x in WLCSP and UFBGA packages. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performances. DS14042 - Rev 2 - November 2022 For further information contact your local STMicroelectronics sales office. www.st.com MLPF-WB-02D3 Characteristics 1 Characteristics Symbol PIN VESD TOP Table 1. Absolute ratings (Tamb = 25 °C) Parameter Input power RFIN ESD ratings human body model (JESD22-A114-C), all I/O one at a time while others connected to GND Maximum operating temperature Value 10 2000 -40 to +105 Unit dBm V °C ...