Document
STPS10L40CSF
Datasheet
40 V, 2 x 5 A low forward voltage power Schottky rectifier
Features
• Low profile design – 1.1mm package typical height • Wettable flanks for automatic visual inspection • Very low conduction losses • High forward surge current capability • ECOPACK2 compliant
Applications
• DC/DC converter • Stand by power • Oring • Polarity protection
Description
This 2 x 5 A, 40 V Schottky diode is suitable for power supply, especially for lighting power, as well as auxiliary power in server or telecom SMPS. Packaged in PSMC (TO-277A), this STPS10L40CSF, dual diode device provides a high level of efficiency in a compact and flat package is ideal for oring function in server for instance.
Product status link STPS10L40CSF
Product summary
IF(AV)
2x5A
VRRM
40 V
Tj (max.)
150 °C
VF (typ.)
0.370 V
DS13739 - Rev 1 - May 2021 For further information contact your local STMicroelectronics sales office.
www.st.com
STPS10L40CSF
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values per diode at 25 °C, unless otherwise specified)
Symbol
Parameter
VRRM
Repetitive peak reverse voltage
IF(AV)
Average forward current, δ = 0.5 square wave
Tc = 135 °C(1)
Per diode Per device
PARM
Repetitive avalanche power
tp = 10 µs
Tj = 125 °C
IFSM
Surge non repetitive forward current tp = 10 ms sinusoidal
Tstg
Storage temperature range
Tj
Maximum operating junction temperature(2)
1. Value based on Rth(j-c)(max.). 2. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Value
Unit
40
V
5 A
10
165
W
120
A
-65 to +175
°C
+150
°C
Symbol Rth(j-c)
Table 2. Thermal resistance parameter
Junction to case, per device
Parameter
Typ. value
Unit
PSMC (TO-277) 1.0 °C/W
For more information, please refer to the following application note: • AN5088: Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics (per diode)
Symbol IR(1)
Parameter Reverse leakage current
VF(2)
Forward voltage drop
1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2%
Test conditions
Tj = 25 °C Tj = 125 °C
VR = VRRM
Tj = 25 °C Tj = 125 °C
IF = 5 A
Tj = 25 °C Tj = 125 °C
IF = 10 A
Min. Typ. Max. Unit
-
125 µA
-
30 50 mA
-
0.495
- 0.370 0.430
V
-
0.600
- 0.505 0.590
To evaluate the conduction losses, use the following equation: P = 0.25 x IF(AV) + 0.036 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode
DS13739 - Rev 1
page 2/9
STPS10L40CSF
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward current versus case temperature (δ = 0.5, per diode)
IF(AV)(A) 25
20
15
10
5
T
0
δ=tp/T
tp
0
25
50
Tc(°C)
75
100
125
150
Figure 2. Relative variation of thermal impedance junction to case versus pulse duration
Zth(j-c) /Rth(j-c) 1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0 1.E-04
1.E-03
1.E-02
1.E-01
t P(s) 1.E+00
Figure 3. Reverse leakage current versus reverse voltage applied (typical values, per diode)
IR(mA) 1.E+02
1.E+01
Tj = 125 °C Tj = 100 °C
1.E+00
Tj = 75 °C
1.E-01 1.E-02
Tj = 50 °C Tj = 25 °C
1.E-03 0
VR(V)
5
10
15
20
25
30
35
40
Figure 4. Junction capacitance versus reverse voltage applied (typical values, per diode)
C(pF) 1000
F = 1 MHz VOSC = 30 mVRMS
Tj = 25 °C
100 1
VR(V)
10
100
Figure 5. Forward voltage drop versus forward current (typical values, per diode)
IF(A) 100.0
10.0
Tj = 25 °C Tj = 75 °C
1.0
Tj = 125 °C Tj = 150 °C
VF(V) 0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Figure 6. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy printed
board FR4, eCu= 70 µm)
Rth(j-a) (°C/W)
120 Epoxy printed board FR4, copper thickness: 70 μm
100
PSMC (TO-277A)
80
60
40
20
SCu(cm²) 0
0
1
2
3
4
5
6
7
8
9
10
DS13739 - Rev 1
page 3/9
STPS10L40CSF
Characteristics (curves)
Figure 7. Normalized avalanche power derating versus pulse duration (Tj = 125 °C)
PARM (t p ) PARM(10 µs) 1
0.1
0.01 0.001
1
t p(µs)
10
100
1000
DS13739 - Rev 1
page 4/9
STPS10L40CSF
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
PSMC (TO-277A) package information
• Epoxy meets UL94,V0
• Cooling method : by conduction (C)
Figure 8. PSMC (TO-277A) package outline
DS13739 - Rev 1
page 5/9
STPS10L40CSF
PSMC (TO-277A) package information
Table 4. PSMC (TO-277A) package mechanical data
Dimensions.