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DSA6331 Data Sheet

Ultra-Low Power MEMS Oscillator

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DSA6331
DSA63XX Ultra-Small, Ultra-Low Power MEMS Oscillator for Automotive with Spread Spectrum for Automotive Features • Automotive AEC-Q100 Qualified • Output Frequency: 1 MHz to 100 MHz LVCMOS • Spread Spectrum Options: - Center-Spread: ±0.25%, ±0.5%, ±1.0%, ±1.5%, ±2.0%, ±2.5% - Down-Spread: –0.25%, –0.5%, –1.0%, –1.5%, –2.0%, –3.0% • Ultra-Low Power Consumption: 3 mA (Active), 1µA (Standby) • Ultra-Small Package Sizes: - 1.6 mm x 1.2 mm VFLGA - 2.0 mm x 1.6 mm VFLGA - 2.5 mm x 2.0 mm VLGA - 3.2 mm x 2.5 mm VDFN - 5.0 mm x 3.2 mm VDFN - 7.0 mm x 5.0 mm VDFN • Excellent Shock and Vibration Immunity - Qualified to MIL-STD-883 • High Reliability - 20x Better MTF Than Quartz Oscillators • Lead Free and RoHS Compliant Applications • Automotive Infotainment • Automotive ADAS • Automotive Camera Module Benefits • Replace High-Temperature Crystals and Quartz Oscillators General Description The DSA63xx series of clock generators uses a proven silicon MEMS technology to provide excellent frequenc.
DSA6331

Download DSA6331 Datasheet
DSA63XX Ultra-Small, Ultra-Low Power MEMS Oscillator for Automotive with Spread Spectrum for Automotive Features • Automotive AEC-Q100 Qualified • Output Frequency: 1 MHz to 100 MHz LVCMOS • Spread Spectrum Options: - Center-Spread: ±0.25%, ±0.5%, ±1.0%, ±1.5%, ±2.0%, ±2.5% - Down-Spread: –0.25%, –0.5%, –1.0%, –1.5%, –2.0%, –3.0% • Ultra-Low Power Consumption: 3 mA (Active), 1µA (Standby) • Ultra-Small Package Sizes: - 1.6 mm x 1.2 mm VFLGA - 2.0 mm x 1.6 mm VFLGA - 2.5 mm x 2.0 mm VLGA - 3.2 mm x 2.5 mm VDFN - 5.0 mm x 3.2 mm VDFN - 7.0 mm x 5.0 mm VDFN • Excellent Shock and Vibration Immunity - Qualified to MIL-STD-883 • High Reliability - 20x Better MTF Than Quartz Oscillators • Lead Free and RoHS Compliant Applications • Automotive Infotainment • Automotive ADAS • Automotive Camera Module Benefits • Replace High-Temperature Crystals and Quartz Oscillators General Description The DSA63xx series of clock generators uses a proven silicon MEMS technology to provide excellent frequency stability over a wide range of temperatures as well as small size. Available in three different package sizes with operating current as low as 3 mA, the smallest 4-pin package is a mere 1.6 mm x 1.2 mm in size. The devices support up to ±2.5% or –3% spread spectrum that can achieve up to 15 dB electromagnetic interference (EMI) reduction. Because of industry standard package and pin options, customers can solve last minute EMI problems simply by placing the new DSA63xx on their current board l.


USBF8100 DSA6331 PIC24FJ64GU205


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