CHIP SCALE SERIES TERMINATION ARRAY
CALIFORNIA MICRO DEVICES
Chip Scale Series Termination Array
Features
• 8 or 16 integrated high frequency series termi...
Description
CALIFORNIA MICRO DEVICES
Chip Scale Series Termination Array
Features
8 or 16 integrated high frequency series terminations
Ultra small footprint Chip Scale Package Ceramic substrate 0.35mm Eutectic Solder Bumps, 0.65mm pitch
Applications
Series resistive bus termination Isolated resistor array
CSPST
Product Description
The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications. Eight (8) or sixteen (16) series termination versions are provided. These resistors provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance as low as ±1%. The Chip Scale
Package provides an ultra small footprint for this IPD and provides minimal parasitics compared to conventional packaging. Typical bump inductance is less than 25pH. The large solder bumps and ceramic substrate allow for standard attachment to laminate printed circuit boards ...
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