Document
Hologram Unit
HUL7001
Hologram Unit
For optical information processing
4.8±0.1 0.8×5=4.0±0.2
Index mark for No.1 pin on reverse side 11.2±0.2 8.2±0.2 ø8.0 +0 –0.05 1 2 3 4 5 6 (0.2) (0.5)
2.55±0.2 0.25 Lead frame 3.0±0.2
Unit : mm
Features
Smaller package size achieved through micro-mirror integration (4.8 × 8.2 × 4.3 mm) Focus error signal detection : SSD method Tracking error signal detection : 3-beam method Low-power semiconductor laser included
(0.3)
O Y Reference plane
Reference plane Apparent emitting point Apparent emitting point Reference plane
Applications
CD
SEC. X-O-Y (Note): 1.Standard corner R=0.20 max. 2.Thickness of plate:Ni 1µm min.+Au 0.1µm min. 3.Thickness of hologram=2.0mm, n=1.519
Absolute Maximum Ratings (Ta = 25˚C)
Parameter Laser beam output Laser reverse voltage Monitor PD reverse voltage Signal processing PD reverse voltage Operating ambient temperature Storage temperature Symbol PO VR(LD) VR(mon) VR Topr Tstg Ratings 0.3 2 12 12 – 10 to +60 – 40 to +85 Unit mW V V V ˚C ˚C
Unit Characteristic Specifications (Tc = 25 ± 3˚C)
Parameter Threshold current Operating current Operating voltage Laser beam output Focus error signal amplitude Tracking error signal amplitude Focus error signal defocusing Tracking error signal symmetry Focus error signal pull-in range
*1 Measurements
Symbol Ith*1 IOP PO
*1,2
Conditions CW CW IRF = 10µA, VR = 5V CW IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V
,, ,, , , ,, ,,, , ,,
8.1±0.2
min 20 25
0.50 0.78±0.2 1.33±0.2
typ 30 35 1.9 0.15
VOP*1,2
*1,2
IFE*1,3 ITE
*1,4
7 0.8 –8 – 30
10 1.3
DFO*1,5 BTE*1,4 DFE*1,3
12
are made using the reference optical system during measurement and the radiant power measurement system on the hologram unit shown in Fig. 2. *2 It should be noted that the RF signal amplitude in these specifications is denoted by I , and represents the amplitude of the 11T RF signal. As in the case described in *1, IRF is measured using the measurement system shown in Fig. 2. *3 The definition is illustrated in Fig. 3. *4 The definition is illustrated in Fig. 4. *5 The definition is illustrated in Fig. 5.
, ,, , ,,,
SEC. X-O-Y
12 11 10 X 9 8 7
(0.35)
4.33±0.2 2.55±0.2
4.7±0.1
max 40 45 2.4 0.22 13 1.8 +8 + 30
Unit mA mA V mW µA µA % % µm
1
HUL7001
Hologram Unit
Characteristic Specifications for Semiconductor Laser, Monitor PD, and Signaling Processing PD (Tc = 25±3˚C)
Parameter Semiconductor laser Oscillating wavelength Coherence Monitor current Dark current Capacitance between pinss Shield frequency
*6 Measurements
Symbol λL*6 λ*6 IP(mon)*7 ID ID(mon)*8 Ct(RF1)*9 Ct(RF2)*9 fC
Conditions CW IRF = 10µA, VR = 5V CW IRF = 10µA, VR = 5V CW IRF = 10µA, VR = 5V VR = 2.5V VR = 5V VR = 2.5V, f = 1MHz VR = 2.5V, RL = 50Ω
min 775
typ 790 0.5
max 805 0.9 1.2 3.0 30
Unit nm
Monitor PD and signal processing PD 0.3 0.7 0.2 0.3 2 3 40 mA nA nA pF pF MHz
are made using the radiant power measurement system on the hologram unit. The definition is presented in Fig. 2. *7 Unless otherwise indicated, the values shown are per individual element. *8 The subscript (mon) denotes the element (monitor PD). *9 C t(RF1) denotes the capacitance measured at pin No. 4 or 10 in the electrode connection diagram. Ct(RF2) denotes the capacitance measured at pin No. 5 or 9 in the electrode connection diagram.
Connection Diagram (Fig. 1)
(a) Pin arrangement Gritty face Represents No.1 pin carved seal on reverse side
Pin Description
Pin No. 1 2 3
12 11 10 9 8 7
TOP VIEW
Function Source voltage Applications pin Monitor current output pin Tracking error signal output pin RF and focus error signal output pin RF and focus error signal output pin Source voltage Applications pin Source voltage Applications pin Tracking error signal output pin RF and focus error signal output pin RF and focus error signal output pin LD + Power supply pin GND pin
Calculation IP (mon) I1 + I6 I3 I2 + I4
Pin No.
1 2 3 4 5 6
4 5 6 7 8 9 10
(b) Chip structure
Pmon P1 P2 P3 P4 P5
LD
P6 P7 P8 P9 P10
LD Pmon
: Semiconductor laser chip : Monitor light detecting element P1 ~ P10 : Signal-detection lightdetecting-elements
I5 + I10 I7 + I9 I8
PD output current In : Output current when light is received by light detecting element N (n : 1 to 10, N = P1 to P10 ) Monitor PD output current IP (mon) : Output current when light is received by Pmon element Focus error signal FE = (I2+I4+I8) – (I3+I7+I9) Disk-close FE > 0 Disk-far FE < 0 TE = (I1+I6) – (I5+I10) The leading beam is the beam received by light detecting elements P1 and P6. RF = I2+I3+I4+I7+I8+I9
11 12
Electrode Connection Diagram
1,6,7 (VR) P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 Pmon LD 11 LD+
Tracking error signal
RF signal
3
4
5
8
9 10
2
12 GND
2
Hologram Unit
HUL7001
Optical Block Diagram During Measurement (Fig. 2)
(a) Radiant power measurement system of hologram unit (HUL7001)
Hologram unit (HUL7001) Optica.