Line Driver. HS9-26C31RH Datasheet

HS9-26C31RH Driver. Datasheet pdf. Equivalent

Part HS9-26C31RH
Description Radiation Hardened Quad Differential Line Driver
Feature HS-26C31RH Data Sheet August 1999 File Number 3401.3 Radiation Hardened Quad Differential Line Driv.
Manufacture Intersil Corporation
Datasheet
Download HS9-26C31RH Datasheet




HS9-26C31RH
Data Sheet
HS-26C31RH
August 1999 File Number 3401.3
Radiation Hardened Quad Differential Line
Driver
The Intersil HS-26C31RH is a quad differential line driver
designed for digital data transmission over balanced lines
and meets the requirements of EIA standard RS-422.
Radiation hardened CMOS processing assures low power
consumption, high speed, and reliable operation in the most
severe radiation environments.
The HS-26C31RH accepts CMOS signal levels and converts
them to RS-422 compatible outputs. This circuit uses special
outputs that enable the drivers to power down without loading
down the bus. Enable and disable pins allow several devices to
be connected to the same data source and addressed
independently.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-96663. A “hot-link” is provided
on our homepage for downloading.
http://www.intersil.com/spacedefense/space.htm
Ordering Information
ORDERING NUMBER
INTERNAL
MKT. NUMBER
TEMP. RANGE
(oC)
5962F9666301QEC HS1-26C31RH-8
-55 to 125
5962F9666301QXC HS9-26C31RH-8
-55 to 125
5962F9666301V9A
HS0-26C31RH-Q
25
5962F9666301VEC HS1-26C31RH-Q
-55 to 125
5962F9666301VXC HS9-26C31RH-Q
-55 to 125
HS1-26C31RH/PROTO HS1-26C31RH/PROTO -55 to 125
HS9-26C31RH/PROTO HS9-26C31RH/PROTO -55 to 125
Logic Diagram
ENABLE ENABLE DIN CIN BIN AIN
DO DO
CO CO
BO BO
AO AO
Features
• Electrically Screened to SMD # 5962-96663
• QML Qualified per MIL-PRF-38535 Requirements
• 1.2 Micron Radiation Hardened CMOS
- Total Dose Up to . . . . . . . . . . . . . . . . . . . . 300kRAD(Si)
- Dose Rate Upset . . . . . . . > 1x109 RAD/s (20ns Pulse)
• Latchup Free
• EIA RS-422 Compatible Outputs (Except for IOS)
• CMOS Inputs
• High Impedance Outputs when Disabled or Powered
Down
• Low Power Dissipation . . . . . . . . . 2.75mW Standby (Max)
• Single 5V Supply
• Low Output Impedance . . . . . . . . . . . . . . . . . 10or Less
• Full -55oC to 125oC Military Temperature Range
Pinouts
HS1-26C31RH (SBDIP)
CDIP2-T16
TOP VIEW
AIN 1
AO 2
AO 3
ENABLE 4
BO 5
BO 6
BIN 7
GND 8
16 VDD
15 DIN
14 DO
13 DO
12 ENABLE
11 CO
10 CO
9 CIN
AIN
AO
AO
ENABLE
BO
BO
BIN
GND
HS9-26C31RH (FLATPACK)
CDFP4-F16
TOP VIEW
1 16
2 15
3 14
4 13
5 12
6 11
7 10
89
VDD
DIN
DO
DO
ENABLE
CO
CO
CIN
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999



HS9-26C31RH
Die Characteristics
DIE DIMENSIONS:
96.5 mils x 195 mils x 21 mils
(2450 x 4950)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 10kÅ ±1kÅ
Metallization:
M1: Mo/TiW
Thickness: 5800Å
M2: Al/Si/Cu (Top)
Thickness: 10kÅ ±1kÅ
Metallization Mask Layout
HS-26C31RH
Substrate:
AVLSI1RA
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
VDD
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0 x 105A/cm2
Bond Pad Size:
110µm x 100µm
HS-26C31RH
AO (2)
AO (3)
ENABLE (4)
BO (5)
BO (6)
(14) DO
(13) DO
(12) ENABLE
(11) CO
(10) CO
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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