Infrared Transceiver. HSDL-1000 Datasheet

HSDL-1000 Transceiver. Datasheet pdf. Equivalent

Part HSDL-1000
Description General Application Guide for the HSDL-1100 4 Mb/s Infrared Transceiver
Feature H Infrared IrDA® Compliant Transceiver Technical Data HSDL-1000 Features • Low Cost Infrared Data .
Manufacture Agilent(Hewlett-Packard)
Datasheet
Download HSDL-1000 Datasheet

H Infrared IrDA® Compliant Transceiver Technical Data HSDL- HSDL-1000 Datasheet
H Infrared IrDA® Compliant Transceiver Technical Data HSDL- HSDL-1000 Datasheet
Recommendation Recommendation Datasheet HSDL-1000 Datasheet





HSDL-1000
H
Infrared IrDA® Compliant
Transceiver
Technical Data
HSDL-1000
Features
• Low Cost Infrared Data Link
• Guaranteed to Meet IrDA
Physical Layer Specifications
1 cm to 1 Meter Operating
Distance
30° Viewing Angle
2.4 KBd to 115.2 KBd Data
Rate
• Daylight Cancellation
• Easily Implemented Direct
Connection to Various I/O
Chips
• Small Form Factor
• Several Lead and Shipping
Configurations Available
• Excellent EMI Immunity
(> 10 V/m)
Applications
• Data Comm: Serial Data
Transfer Between:
Notebook Computers
Subnotebooks
Desktop PCs
PDAs
Printers
Other Peripheral Devices
• Telecom:
Modem, Fax, Pager, Phone
• Industrial:
Data Collection Devices
• Medical:
Patient and Pharmaceutical
Data Collection
Description:
The HSDL-1000 serial infrared
module performs low cost, low
power, point-to-point, through the
air data transfer in a serial, half-
duplex mode.
The module has been designed to
the IrDA (Infrared Data Associa-
tion) Physical Layer Specifica-
tions. The module is designed to
operate from 0 to 1 meter at a
data rate of 115.2 Kbd per second
at a 30° viewing angle.
The HSDL-1000 contains a high
speed, high efficiency TS AlGaAs
875 nm LED, a PIN Silicon photo-
diode and an integrated circuit.
The IC contains an LED driver,
amplifiers and a quantizer.
The module is designed to inter-
face directly with selected I/O
chips that incorporate logic which
performs pulse width modulation/
demodulation.
V+
Schematic
LED C
RLED
LED A
BUTTRESS
LEAD*
PIN ONE
TXD
RXD
RI TXD
LED
VPIN
RXD
CX1
PHOTODIODE
COMPARATOR
HP 1000
YYWW
PIN ONE
INDICATOR
PIN ONE
V+ VCC
CX4 CX3
GND
CX2
CX2
GND
+
VPIN
5964-9641E
* SIDE BUTTRESS LEADS ARE FOR MECHANICAL STABILITY AND
SHOULD NOT BE CONNECTED TO ANY ELECTRICAL POTENTIAL.
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HSDL-1000
Package Dimensions
Option X01*
(00..04137)MAX.
3.4 ± 0.25
(0.14 ± 0.01)
12.95 (0.51)
13.45 (0.53)
6.4 ± 0.25
(0.25 ± 0.01)
3.4 ± 0.25
(0.14 ± 0.01)
(08..35346±±00.1.051)MAX.
-B-
0.9 ± 0.25
(0.04 ± 0.01)
6.9 ± 0.25
(0.27 ± 0.01)
1 2 3 4 5 67 8
0.51 ± 0.08 (8x)
(0.020 ± 0.003)
-C-
1.27 ± 0.15 (7x)
(0.050 ± 0.01)
1.9 ± 0.25
(0.08 ± 0.01)
6.2 ± 0.25
(0.24 ± 0.01)
-A-
16.61 ± 0.15
(0.654 ± 0.01)
5.0° (10x)
0.6 ± 0.25 (10x)
(0.02 ± 0.01)
DIMENSIONS IN MILLIMETERS (INCHES).
5.93 ± 0.25
(0.23 ± 0.01)
0.13 ± 0.08
(0.005 ± 0.003)
Option X02*
0.43 MAX.
(0.017)
3.4 ± 0.25
(0.14 ± 0.01)
13.2 ± 0.25
(0.52 ± 0.01)
6.4 ± 0.25
(0.25 ± 0.01)
8.05 ± 0.15 MAX.
(0.317 ± 0.01)
6.9 ± 0.25
(0.27 ± 0.01)
1 2 3 4 5 67 8
4.56 ± 0.15
(0.180 ± 0.01)
1.28 ± 0.15
(0.050 ± 0.01)
-A- 5.0° (8x)
1.27 ± 0.15 (7x)
(0.050 ± 0.01)
15.39 ± 0.15
(0.606 ± 0.01)
-B-
3.36 ± 0.15
(0.132 ± 0.01)
0.50 ± 0.13
(0.020 ± 0.005)
-C-
15.13 ± 0.15
(0.596 ± 0.01)
3.12 ± 0.15
(0.123 ± 0.01)
3.28 ± 0.15
(0.129 ± 0.01)
6.2 ± 0.25
(0.24 ± 0.01)
3.80 ± 0.15
(0.150 ± 0.01)
8.88 ± 0.15
(0.349 ± 0.01)
0.60 ± 0.25
(0.02 ± 0.01)
COPLANARITY ± 0.05 mm (0.002 INCHES).
DIMENSIONS IN MILLIMETERS (INCHES).
3.4 ± 0.25
(0.14 ± 0.01)
0.51
(0.020
±
±
00..00803)(8x)
5.93 ± 0.25
(0.23 ± 0.01)
Note:
The -B- datum is formed by the two highest points of the combined surface formed by this surface and the corresponding surface of the
same lead on the opposite side of the package.
*X position indicates packaging. 0 = tape and reel, 1 = JEDEC standard tray.
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